Document
Stacked Film Capacitor Chips
NSWC Series
FEATURES NSWC IS • STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM RECOMMENDED • STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES FOR NEW DESIGNS • WIDE TEMPERATURE RANGE UP TO +125OC* • HIGH HEAT AND MOISTURE RESISTANT RoHS • VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS Compliant includes all homogeneous materials nCHARACTERISTICS • REFLOW SOLDERING ONLY *See Part Number System for Details • TAPE AND REEL PACKAGING
SPECIFICATIONS Capacitance Range Votage Ratings Capacitance Tolerance Temperature Range Dissipation factor (20°C) Insulation resistance (20°C) Dielectric Withstanding Voltage 1206 0.001 ~ 0.0047μF 1210 0.0056 ~ 0.01μF Case Sizes 1913 2416 2820 3022 3925 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF 100Vdc 0.001 ~ 0.01μF 5% (J) only, 0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only -55°C ~ +105°C (0.001μF ~ 0.01μF) -55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C) 1.0% max. @ 1KHz 3 Gigohms or 1000Ω/F whichever is lower 150% of Rated Voltage 60 Seconds
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C 1,000 Hours at 125% of Rated Voltage (125°C for 0.012μF ~ 1.0μF) Resistance to Soldering Heat: +240°C Peak Humidity Load Life (90% ~ 95% RH) (1) 1,000 Hours, +40°C 500 Hours for 0.012μF ~ 1.0μF (2) 500 Hours, +60°C for 0.001 ~ 0.01μF Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Within +1%/-6% of Initial Value 1.1% Maximum 1 Gigohm Minimum or 300Ω/F whichever is lower Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value 1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF 1 Gigohm Minimum or 300Ω/F whichever is lower (1) +8%/-5% (2) ±10% of Initial Value (1) 1.5% Max. (2) 2.0% Max. (1) 100 Megohm Min. or 30Ω/F (2) 10 Megohm Min. or 3Ω/F whichever is lower
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
RECOMMENDED LAND PATTERN (mm)
Temperature - Deg. C EIA Size 1206 1210 1913 2416 2820 3022 3925 A 1.8 1.8 2.6 3.8 4.5 5.1 7.2 B 3.6 3.6 6.6 7.8 9.0 9.7 11.9 C 1.4 2.3 3.0 3.8 4.6 5.0 5.7
RECOMMENDED REFLOW PROFILE
300 250 200 150 100 50 25 Ramp-up 25°C ~ 150°C 90 sec. max. Pre-heat 150°C ~ 180°C 120 sec. max. Cool Down Time above 220°C 60 sec. max. Standard: +240 °C Peak Temperature +250°C Special Order (see part numbering system)
C
0
Time
A B
PART NUMBER SYSTEM
NSWC 823 J 100 TR D4 N F RoHS Compliant Optional High Temp. Reflow (+250°C)* Size Code Tape & Reel Voltage Tolerance Code: J = ±5% Capacitance in pF, 1st two digits are significant, 3rd digit is no. of zeros Series *Special packaging and handling required.
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NIC COMPONENTS CORP. www.niccomp.com
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SPECIFICATIONS ARE SUBJECT TO CHANGE
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Stacked Film Capacitor .