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HC2LP

Cooper Bussmann

HIGH CURRENT 2LP Low Profile Power Inductors

HIGH CURRENT 2LP Low Profile Power Inductors Description RoHS 2002/95/EC • Compact footprint for high density, high curr...


Cooper Bussmann

HC2LP

File Download Download HC2LP Datasheet


Description
HIGH CURRENT 2LP Low Profile Power Inductors Description RoHS 2002/95/EC Compact footprint for high density, high current/low voltage applications Foil technology that adds higher reliability f actor over the traditional magnet wire used for higher frequency circuit designs Frequency Range up to 1MHz Ferrite core material Applications Next generation microprocessors Energy storage applications DC-DC converters Computers Environmental Data Storage temperature range: -40°C to +125°C Operating ambient temperature range: -40°C to +85°C (range is application specific). Solder reflow temperature: +260°C max. for 10 seconds max. Part Number HC2LP-R47-R HC2LP-R68-R HC2LP-1R0-R HC2LP-2R2-R HC2LP-4R7-R HC2LP-6R0-R Rated Inductance µH .47 .68 1.0 2.2 4.7 6.0 OCL (1) µH ± 20% .52 .63 1.15 2.00 4.55 6.00 Irms (2) Amperes (Typ.) 52.9 52.9 33.0 24.3 17.0 17.0 Packaging Supplied in tape and reel packaging, 44mm width, 130 parts per 13" reel Isat (3) Amperes (Typ.) 63.75 50.00 42.50 31.90 21.25 16.50 DCR (4) Ohms (Max.) .0006 .0006 .0013 .0023 .0046 .0046 Volts (5) µSec 6.87 6.87 10.31 13.75 20.62 20.62 1) Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 2) DC current for an approximate temperature change of 40°C without core loss . Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of th...




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