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K2876-01MR Dataheets PDF



Part Number K2876-01MR
Manufacturers Fuji Electric
Logo Fuji Electric
Description 2SK2876-01MR
Datasheet K2876-01MR DatasheetK2876-01MR Datasheet (PDF)

2SK2876-01MR FAP-IIS Series > Features High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated N-channel MOS-FET 500V 1,5Ω ±6A 30W > Outline Drawing > Applications Switching Regulators UPS DC-DC converters General Purpose Power Amplifier > Maximum Ratings and Characteristics - Absolute Maximum Ratings (TC=25°C), unless otherwise specified Item Drain-Source-Voltage Continous Drain Current Pulsed Drain Cur.

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2SK2876-01MR FAP-IIS Series > Features High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated N-channel MOS-FET 500V 1,5Ω ±6A 30W > Outline Drawing > Applications Switching Regulators UPS DC-DC converters General Purpose Power Amplifier > Maximum Ratings and Characteristics - Absolute Maximum Ratings (TC=25°C), unless otherwise specified Item Drain-Source-Voltage Continous Drain Current Pulsed Drain Current Gate-Source-Voltage Repetitive or Non-Repetitive (Tch ≤ 150°C) Avalanche Energy Max. Power Dissipation Operating and Storage Temperature Range Symbol V DS ID I D(puls) V GS I AR E AS PD T ch T stg Rating 500 ±6 ±24 ±35 6 196.9 30 150 -55 ~ +150 L=10.0mH,Vcc=50V > Equivalent Circuit Unit V A A V A mJ W °C °C - Electrical Characteristics (TC=25°C), unless otherwise specified Item Drain-Source Breakdown-Voltage Gate Threshhold Voltage Zero Gate Voltage Drain Current Gate Source Leakage Current Drain Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On-Time ton (ton=td(on)+tr) Turn-Off-Time toff (ton=td(off)+tf) Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge - Thermal Characteristics Item Thermal Resistance Symbol BV DSS V GS(th) I DSS I R g C C C t t t t I V t Q GSS DS(on) fs iss oss rss d(on) r d(off) f AV SD rr rr Test conditions ID=1mA VGS=0V ID=1mA VDS=VGS VDS=500V Tch=25°C VGS=0V Tch=125°C VGS=±35V VDS=0V ID=3A VGS=10V ID=3A VDS=25V VDS=25V VGS=0V f=1MHz VCC=300V ID=6A VGS=10V RGS=10 Ω Tch=25°C L = 10,0mH IF=2xIDR VGS=0V Tch=25°C IF=IDR VGS=0V -dIF/dt=100A/µs T ch=25°C Min. 500 3,5 Typ. 4,0 10 0,2 10 1,25 4 540 100 45 13 40 30 25 1,0 450 3,2 Max. 4,5 500 1,0 100 1,5 810 150 70 20 60 45 40 1,5 2 6 Unit V V µA mA nA Ω S pF pF pF ns ns ns ns A V ns µC Symbol R th(ch-c) R th(ch-a) Test conditions channel to case channel to air Min. Typ. Max. 4,17 62,5 Unit °C/W °C/W http://www.Datasheet4U.com N-channel MOS-FET 500V 1,5Ω 2SK2876-01MR FAP-IIS Series Drain-Source-On-State Resistance vs. Tch RDS(on) = f(T ch): ID=3A; VGS=10V ±6A 30W > Characteristics Typical Output Characteristics ID=f(VDS); 80µs pulse test; T C=25°C Typical Transfer Characteristics ID=f(V GS); 80µs pulse test; VDS=25V; Tch=25°C ↑ ID [A] ↑ 1 RDS(ON) [Ω ] ↑ 2 ID [A] 3 VDS [V] → Tch [°C] → VGS [V] → Typical Drain-Source-On-State-Resistance vs. ID RDS(on)=f(ID); 80µs pulse test;T C=25°C Typical Forward Transconductance vs. ID gfs=f(I D); 80µs pulse test; VDS=25V; Tch=25°C Gate Threshold Voltage vs. Tch VGS(th)=f(T ch); ID=1mA; V DS=VGS ↑ RDS(ON) [Ω ] ↑ gfs [S] ↑ 5 VGS(th) [V] 4 6 ID [A] → ID [A] → Tch [°C] → Typical Capacitances vs. VDS C=f(VDS); VGS=0V; f=1MHz Typical Gate Charge Characteristic VGS=f(Qg): ID=6A; Tc=25°C Forward Characteristics of Reverse Diode IF=f(V SD); 80µs pulse test; VGS=0V ↑ C [F] ↑ VDS [V] ↑ VGS [V] .


DD313 K2876-01MR P3156


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