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HD6433802H Dataheets PDF



Part Number HD6433802H
Manufacturers Hitachi Semiconductor
Logo Hitachi Semiconductor
Description Single-Chip Microcomputer
Datasheet HD6433802H DatasheetHD6433802H Datasheet (PDF)

Hitachi Single-Chip Microcomputer H8/3802 Series H8/3802 H8/3801 H8/3800 HD6473802, HD6433802 HD6433801 HD6433800 Hardware Manual ADE-602-203A Rev. 2.0 1/9/01 Hitachi Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectu.

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Hitachi Single-Chip Microcomputer H8/3802 Series H8/3802 H8/3801 H8/3800 HD6473802, HD6433802 HD6433801 HD6433800 Hardware Manual ADE-602-203A Rev. 2.0 1/9/01 Hitachi Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. List of Items Revised or Added for This Version Section 1.1 Overview 2.8.1 Memory Map Page 3 46 47 3.3.1 Overview 3.3.2 Interrupt Control Registers 60 61 Item Table 1.1 Features Figure 2.16(2) H8/3801 Memory Map Figure 2.16(3) H8/3800 Memory Map Table 3.2 Interrupt Sources and Their Priorities Table 3.3 Interrupt Control Registers Description Description of time specification amended Figure amended Figure amended Amended Initial values amended 1. IRQ edge select register (IEGR) Bits 4 to 2 amended 62 63 to 65 65 67, 68 3.3.5 Interrupt Operations 3.4.2 Notes on Rewriting Port Mode Registers 3.4.3 Interrupt Request Flag Clearing Methods 74 79 2. Interrupt enable register 1 (IENR1) 3. Interrupt enable register 2 (IENR2) 4. Interrupt request register 1 (IRR1) 5. Interrupt request register 2 (IRR2) Figure 3.3 Flow up to Interrupt Acceptance Bits 6, 4, and 3 amended Bits 5, 4, and 1 amended Bits 6, 4, and 3 amended Bits 5, 4, and 1 amended Figure amended Table 3.5 Conditions under which IRREC2 flag condition Interrupt Request Flag is Set to 1 amended 3.4.3 Interrupt Request Flag Clearing Method 4.5.1 Definition of Oscillation Setting Standby Time 4.5.2 Notes on Use of Crystal Oscillator Element(Excluding Ceramic Oscillator Element) Description added 80 4.5 Note on Oscillators 90 to 92 Description added 5.1 Overview 95 Table 5.2 Internal State in Each Operating Mode Table 5.4 Clock Frequency and Setting Time Note 7 amended Changed 5.3.3 Oscillator Setting 103 Time after Standby Mode is Cleared Section 5.5.2 Clearing Subsleep Mode 5.6 Subactive Mode 6.3.1 Writing and Verifying 8.1 Overview Page 108 109 122 131, 132 Item • Clearing by interrupt Description Description amended 5.6.1 Transition to Subactive Mode Description amended Figure 6.4 High-Speed,HighWrite time tOPW amended Reliability Programming Flow Chart Table 8.1 Port Functions Other function of port 3 and description of port 9 amended Amended and register added Bit 0 and description amended Bit 0 and description amended Bit 0 and description amended Bits 5 to 3 and 0, and description amended Added Initial value amended 8.2.2 Register Configuration and Description 133 Table 8.2 Port 3 Registers 134 1. Port data register 3 (PDR3) 2. Port control register 3 (PCR3) 3. Port pull-up control register 3 (PUCR3) 135, 136 136 8.3.2 Register Configuration and Description 139 4. Port mode register 3 (PMR3) 5. Port mode register 2 (PMR2) Table 8.5 Port 4 Register 140, 141 8.3.3 Pin Functions 8.7.2 Register Configuration and Description 141 155 3. Port mode register 2 (PMR2) Table 8.6 Port 4 Pin Functions Table 8.17 Port 8 Registers Bits 2 and 1, and description amended Description amended Initial value amended 156 1. Port data register 8 (PDR8) .


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