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DP2012-E2455BB

Advanced Ceramic X

Multilayer Chip Diplexers

DP 2012 Series Multilayer Chip Diplexers Features ™ Monolithic structure including one low-pass and one band-pass filter...


Advanced Ceramic X

DP2012-E2455BB

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DP 2012 Series Multilayer Chip Diplexers Features ™ Monolithic structure including one low-pass and one band-pass filters with loss pole at adjacent passband. ACX Advanced Ceramic X Applications ™ Dual-band / dual-mode 2.4GHz/5GHz WLAN Specifications Passband (MHz) Insertion Loss (dB) Attenuation I (dB) Attenuation II (dB) Passband VSWR Q’ty/ Reel (pcs) Part Number DP2012 -E2455BB_ 2400~2500 0.7 max. 4900~5900 1.0 max. 18 min. @ 4.8 ~ 6.0 GHz 19 min. @ 1.8 ~ 2.5 GHz 18 min. @ 2.0 max. 7.2 ~ 7.5GHz 4,000 25 ref. @ 2.0 max. 10.3 ~ 10.7GHz Operating Temperature Range Storage Temperature Range Storage Period Power Capacity : -40 ~ +85 oC o : +5 ~ +35 C, Humidity 45~75%RH : 12 months max. : 2W max. Part Number DP c c Type e Material Code g Specification Code i Soldering 2012 d - E e 2455 f BB g ‡ h /LF i 2.0 × 1.2 mm 2455=2400MHz /5500MHz T: Tape & Reel B: Bulk DP : Diplexer E BB =lead-containing /LF=lead-free d Dimensions ( L × W ) f Frequency Range h Packaging Terminal Configuration e d c No. Terminal Name Higher Freq. Port (P1) GND Lower Freq. Port (P3) No. Terminal Name GND Common Port (P2) GND c d f g h e f g h ACX Dimensions and Recommended PC Board Pattern a W c L g b T p Advanced Ceramic X Unit : mm Mark Dimensions L 2.0 ± 0.1 W 1.25 ± 0.1 T 0.55 ± 0.1 a 0.3 ± 0.1 b 0.2 ± 0.1 c 0.3+0.1 /-0.2 g 0.35 ± 0.1 p 0.65 ± 0.05 2.80 * 0.35 1.65 Solder Resist Land Through-hole (φ 0.35) * 0.30 1.00 0.80 * * Line width should be designed to matc...




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