Multilayer Chip Diplexers
DP 2012 Series
Multilayer Chip Diplexers
Features
Monolithic structure including one low-pass and one band-pass filter...
Description
DP 2012 Series
Multilayer Chip Diplexers
Features
Monolithic structure including one low-pass and one band-pass filters with loss pole at adjacent passband.
ACX
Advanced Ceramic X
Applications
Dual-band / dual-mode 2.4GHz/5GHz WLAN
Specifications
Passband (MHz) Insertion Loss (dB) Attenuation I (dB) Attenuation II (dB) Passband VSWR Q’ty/ Reel (pcs)
Part Number
DP2012 -E2455BB_
2400~2500 0.7 max. 4900~5900 1.0 max.
18 min. @ 4.8 ~ 6.0 GHz 19 min. @ 1.8 ~ 2.5 GHz
18 min. @ 2.0 max. 7.2 ~ 7.5GHz 4,000 25 ref. @ 2.0 max. 10.3 ~ 10.7GHz
Operating Temperature Range Storage Temperature Range Storage Period Power Capacity
: -40 ~ +85 oC o : +5 ~ +35 C, Humidity 45~75%RH : 12 months max. : 2W max.
Part Number DP c c Type e Material Code g Specification Code i Soldering 2012 d - E e 2455 f BB g h /LF i
2.0 × 1.2 mm 2455=2400MHz /5500MHz T: Tape & Reel B: Bulk
DP : Diplexer E BB =lead-containing /LF=lead-free
d Dimensions ( L × W ) f Frequency Range h Packaging
Terminal Configuration
e
d
c
No.
Terminal Name Higher Freq. Port (P1) GND Lower Freq. Port (P3)
No.
Terminal Name GND Common Port (P2) GND
c d f g h e
f g h
ACX
Dimensions and Recommended PC Board Pattern
a W c L g b T p
Advanced Ceramic X
Unit : mm
Mark Dimensions
L
2.0 ± 0.1
W
1.25 ± 0.1
T
0.55 ± 0.1
a
0.3 ± 0.1
b
0.2 ± 0.1
c
0.3+0.1 /-0.2
g
0.35 ± 0.1
p
0.65 ± 0.05
2.80
*
0.35 1.65 Solder Resist Land Through-hole (φ 0.35)
*
0.30 1.00 0.80
*
* Line width should be designed to matc...
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