Multilayer Chip Diplexers
DP 2012 Series
Multilayer Chip Diplexers
Features
Monolithic structure including one low-pass and one high-pass filter...
Description
DP 2012 Series
Multilayer Chip Diplexers
Features
Monolithic structure including one low-pass and one high-pass filters with loss pole at adjacent passband.
ACX
Advanced Ceramic X
Applications
Dual-band / dual-mode 2.4GHz/5GHz WLAN
Specifications
Attenuation Attenuation @ Low Band @ High Band (dB) (dB) Q’ty/ Reel (pcs)
Part Number
Passband (MHz)
Passband VSWR
DP2012-B2455CA_
Operating Temperature Range Storage Temperature Range Storage Period Power Capacity
2400-2500 4900-5875
0.70 max. 20 min.
15 min. 0.9 max.
2.0 max. 2.0 max.
4,000
: -40 ~ +85 oC o : +5 ~ +35 C, Humidity 45~75%RH : 12 months max. : 2W max.
Part Number DP c c Type e Material Code g Specification Code Terminal Configuration 2012 d - B e 2455 f CA g h
2.0 × 1.2 mm 2455=2400MHz /5500MHz T: Tape & Reel B: Bulk
DP : Diplexer B CA
d Dimensions ( L × W ) f Frequency Range h Packaging
e f g
d
c j
No.
Terminal Name GND Common Port (P1) GND Lower Freq. Port (P3)
No.
Terminal Name GND GND GND Higher Freq. Port (P2)
c d e f
g h i j
h
i
ACX
Dimensions and Recommended PC Board Pattern
a a c L g b p
Advanced Ceramic X
Unit : mm
W
T
Mark Dimensions
L
2.0 ± 0.1
W
1.25 ± 0.1
T
0.95 ± 0.1
a
0.3 ± 0.1
b
0.2 ± 0.1
c
0.3+0.1 /-0.2
g
0.35 ± 0.1
p
0.65 ± 0.05
2.80
*
0.35 1.65 Solder Resist Land Through-hole (φ 0.35)
*
0.30 1.0 0.35
*
* Line width should be designed to match 50Ωcharacteristic impedance, depending on PCB material and thickness.
Measuring Diagram
Port 3 (50Ω)
Ne...
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