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HD74HC00 Dataheets PDF



Part Number HD74HC00
Manufacturers Hitachi Semiconductor
Logo Hitachi Semiconductor
Description Quad. 2-input NAND Gates
Datasheet HD74HC00 DatasheetHD74HC00 Datasheet (PDF)

HD74HC00 Quad. 2-input NAND Gates Features • • • • • High Speed Operation: tpd = 8.5 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C) Pin Arrangement 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 (Top view) 14 VCC 13 4B 12 4A 11 4Y 10 3B 9 8 3A 3Y HD74HC00 Circuit Schematic (1/4) VCC Y A B GND DC Characteristics Ta = 25°C Item Input voltage Symbol .

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HD74HC00 Quad. 2-input NAND Gates Features • • • • • High Speed Operation: tpd = 8.5 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C) Pin Arrangement 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 (Top view) 14 VCC 13 4B 12 4A 11 4Y 10 3B 9 8 3A 3Y HD74HC00 Circuit Schematic (1/4) VCC Y A B GND DC Characteristics Ta = 25°C Item Input voltage Symbol VIH Ta = –40 to +85°C Max — — — 0.5 1.35 1.8 — — — — — 0.1 0.1 0.1 0.33 0.33 I OL = 4 mA I OL = 5.2 mA V I OH = –4 mA I OH = –5.2 mA Vin = VIH or VIL I OL = 20 µA V Vin = VIH or VIL I OH = –20 µA V Unit V Test Conditions VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 — 3.15 — 4.2 — — — — — — — — — — 0.5 1.5 3.15 4.2 — VIL 2.0 4.5 6.0 1.35 — 1.8 — 1.9 4.4 5.9 4.13 5.63 — — — Output voltage VOH 2.0 4.5 6.0 4.5 6.0 1.9 2.0 — 4.4 4.5 — 5.9 6.0 — 4.18 — 5.68 — — — — — — — — VOL 2.0 4.5 6.0 4.5 6.0 0.0 0.1 0.0 0.1 0.0 0.1 — — 0.26 — 0.26 — 2 HD74HC00 DC Characteristics (cont) Ta = 25°C Item Input current Quiescent supply current Symbol Iin I CC Ta = –40 to +85°C Max ±1.0 10 Unit µA µA Test Conditions Vin = VCC or GND Vin = VCC or GND, Iout = 0 µA ±0.1 — 1.0 — VCC (V) Min Typ Max Min 6.0 6.0 — — — — AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25°C Item Symbol Ta = –40 to +85°C Max 115 23 20 115 23 20 95 19 16 95 19 16 10 pF ns ns ns Unit ns Test Conditions VCC (V) Min Typ Max Min 2.0 4.5 6.0 — — — — — — — — — — — — — — 9 — — 8 — — 7 — — 7 — 5 90 18 15 90 18 15 75 15 13 75 15 13 10 — — — — — — — — — — — — — Propagation delay t PLH time t PHL 2.0 4.5 6.0 Output rise time t TLH 2.0 4.5 6.0 Output fall time t THL 2.0 4.5 6.0 Input capacitance Cin — 3 Unit: mm 19.20 20.32 Max 14 8 6.30 7.40 Max 1 2.39 Max 1.30 7 7.62 0.51 Min 2.54 Min 5.06 Max 2.54 ± 0.25 0.48 ± 0.10 0.25 – 0.05 0° – 15° + 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 14 8 5.5 1 7 *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 7.80 – 0.30 1.15 0° – 8° + 0.20 1.42 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.70 ± 0.20 0.15 0.12 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DA — Conforms 0.23 g *Dimension including the plating thickness Base material dimension Unit: mm 8.65 9.05 Max 14 8 3.95 1 1.75 Max 7 *0.20 ± 0.05 6.10 – 0.30 1.08 + 0.10 0.635 Max 0° – 8° 0.67 0.60 + – 0.20 1.27 *0.40 ± 0.06 0.11 0.14 + – 0.04 0.15 0.25 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DN Conforms Conforms 0.13 g *Pd plating Unit: mm 5.00 5.30 Max 14 8 4.40 1 *0.22+0.08 –0.07 7 0.65 1.0 0.13 M 0.83 Max *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 6.40 ± 0.20 0° – 8° 0.50 ± 0.10 0.20 ± 0.06 0.10 0.07 +0.03 –0.04 *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) TTP-14D — — 0.05 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semi.


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