Document
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256Mb: x4, x8, x16 DDR2 SDRAM
SAA64M4.....– 16 Meg x 4 x 4 SAA32M8.....– 8 Meg x 8 x 4 SAA16M16.....– 4 Meg x 16 x 4
For the latest data sheet, please refer to the SpecTek Web site: http://www.spectek.com
DDR2 SDRAM
Features
• • • • • • • • • • • • • • ROHS compliant VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V JEDEC standard 1.8V I/O (SSTL_18-compatible) Differential data strobe (DQS, DQS#) option Four-bit prefetch architecture DLL to align DQ and DQS transitions with CK Four internal banks for concurrent operation Programmable CAS Latency (CL): 3 and 4 Posted CAS additive latency (AL): 0, 1, 2, 3, and 4 WRITE latency = READ latency - 1 tCK Programmable burst lengths: 4 or 8 Adjustable data-output drive strength 64ms, 8,192-cycle refresh On-die termination (ODT)
Options1, 2
• SpecTek Memory • Configuration 64 Meg x 4 (16 Meg x 4 x 4) 32 Meg x 8 ( 8 Meg x 8 x 4) 16 Meg x 16 (4 Meg x 16 x 4) • Product Code DDR2 • Density 256 Megabits • Voltage/Refresh 1.8V/8K refresh • Package – Lead-Free x4, x8 60-ball FBGA (8mm x 12mm) x16 84-ball FBGA (8mm x 14mm) • Package – Leaded x4, x8 60-ball FBGA (8mm x 12mm) x16 84-ball FBGA (8mm x 14mm) • Timing – Cycle Time 3.0ns @ CL = 5 (DDR2-667) 3.75ns @ CL = 4 (DDR2-533)
NOTE:
Designation
SAA
Architecture 64 Meg x 4
16 Meg x 4 x 4 8K 8K (A0–A12) 4 (BA0–BA1) 2K (A0–A9, A11)
32 Meg x 8
8 Meg x 8 x 4 8K 8K (A0–A12) 4 (BA0–BA1) 1K (A0–A9)
16 Meg x 16
4 Meg x 16 x 4 8K 8K (A0–A12) 4 (BA0–BA1) 512 (A0–A8)
64M4 32M8 16M16 Ux3 6x3 O8
Configuration Refresh Count Row Addressing Bank Addressing Column Addressing
Table 1:
Speed Grade -3 -37E
Key Timing Parameters
Data Rate (MHz) CL = 4 NA 533 CL = 5 667 533
tRCD
FIF FPF
(ns) 15 15
tRP (ns)
tRc (ns)
15 15
60 60
FIL
Part Number Example:
FPL -3 -37E
SAA32M8U26AO8FIF-37E
1. See page 42 for part number options and designations used prior to March 2005. 2. See page 42 for part number options and designations used prior to July 2006. 3. Contact SpecTek Sales for details on availability of the "x" placeholders
PDF: 09005aef81548c1c/Source: 09005aef819e80c5 SpecTek_DDR2_256Mb_1.fm - Rev. C 7/06 EN
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SpecTek reserves the right to change products or specifications without notice. ©2003 Micron Technology, Inc. All rights reserved.
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256Mb: x4, x8, x16 DDR2 SDRAM
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 FBGA Part Marking Decoder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 AC and DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Input Electrical Characteristics and Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Input Slew Rate Derating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Data Slew Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Power and Ground Clamp Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 AC Overshoot/Undershoot Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Output Electrical Characteristics and Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Full Strength Pull-Down Driver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Full Strength Pull-Up Driver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 FBGA Package Capacitance . . . . . . . . . . . . . . . . . . . . .