CP1005

CP1005 Series (Preliminary) Multilayer Chip Couplers Features  Monolithic SMD with ultra-small, low-profiled, and light-weight type. ACX Advanced Ceramic X Applications 0.4 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc. Specifications Insertion Loss (MHz) (dB) VSWR Frequency Part Number Coupling (dB) Isolation (dB) CP1005-19C0897_ Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity 880 ~ 915 0.25 max. 1.3 max. 18.5  1.0 33.0 : 10000 : -40 ~ +85 oC o : +5 ~ +35 C, Humidity 45~75%RH : 12 months max. : 3W max. Part Number CP   Type  Coupling  Central Frequency  Soldering 1005  CP : Coupler 19 : 18.5 dB 0897 : 897MHz =lead-containing /LF=lead-free - 19  C  0897    /LF  1.0 × 0.5 mm C T: Tape & Reel B: Bulk  Dimensions ( L × W )  Specification Code  Packaging CP1005-19C0897T/LF REV:2 PAGE:1/7 ACX Terminal Configuration Advanced Ceramic X   No. Terminal Name Out IN No. Terminal Name Coupling Termination       Dimensions and Recommended PC Board Pattern Unit : mm b W a c L T Mark Dimensions L 1.0  0.1 W 0.5  0.1 T 0.37  0.05 a 0.1 b 0.25 c 0.1 +0.1/-0.05 +0.1/-0.05 +0.1/-0.05 * 0.25 0.25 * Solder Resist 0.35 Land Through-hole ( 0.3) * 0.4 * * Line width should be designed to match 50characteristic impedance, depending on PCB material and thickness. CP1005-19C0897T/LF REV:2 PAGE:2/7 AC...