Multilayer Chip Couplers
CP1005 Series (Preliminary)
Multilayer Chip Couplers
Features
Monolithic SMD with ultra-small, low-profiled, and light...
Description
CP1005 Series (Preliminary)
Multilayer Chip Couplers
Features
Monolithic SMD with ultra-small, low-profiled, and light-weight type.
ACX
Advanced Ceramic X
Applications
0.4 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.
Specifications
Insertion Loss (MHz) (dB) VSWR
Frequency Part Number
Coupling (dB)
Isolation (dB)
CP1005-19C0897_
Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity
880 ~ 915
0.25 max.
1.3 max.
18.5 1.0
33.0
: 10000 : -40 ~ +85 oC o : +5 ~ +35 C, Humidity 45~75%RH : 12 months max. : 3W max.
Part Number CP Type Coupling Central Frequency Soldering 1005
CP : Coupler 19 : 18.5 dB 0897 : 897MHz =lead-containing /LF=lead-free
-
19
C
0897
/LF
1.0 × 0.5 mm C T: Tape & Reel B: Bulk
Dimensions ( L × W ) Specification Code Packaging
CP1005-19C0897T/LF REV:2 PAGE:1/7
ACX
Terminal Configuration
Advanced Ceramic X
No.
Terminal Name Out IN
No.
Terminal Name Coupling Termination
Dimensions and Recommended PC Board Pattern
Unit : mm
b W a c L T
Mark Dimensions
L
1.0 0.1
W
0.5 0.1
T
0.37 0.05
a
0.1
b
0.25
c
0.1 +0.1/-0.05
+0.1/-0.05 +0.1/-0.05
*
0.25
0.25
*
Solder Resist
0.35
Land Through-hole ( 0.3)
*
0.4
*
* Line width should be designed to match 50characteristic impedance, depending on PCB material and thickness.
CP1005-19C0897T/LF REV:2 PAGE:2/7
AC...
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