FLASH MEMORY. W25Q64FV Datasheet

W25Q64FV MEMORY. Datasheet pdf. Equivalent

W25Q64FV Datasheet
Recommendation W25Q64FV Datasheet
Part W25Q64FV
Description 3V 64M-BIT SERIAL FLASH MEMORY
Feature W25Q64FV; W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, .
Manufacture Winbond
Datasheet
Download W25Q64FV Datasheet




Winbond W25Q64FV
W25Q64FV
3V 64M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
Publication Release Date: July 18, 2017
- 1 Revision S



Winbond W25Q64FV
W25Q64FV
Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................... 5
2. FEATURES....................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm ........................................... 6
3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7
3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300-
mil 7
3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8
3.6 Pin Description SOIC 300-mil............................................................................................... 8
3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9
3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9
3.9 Ball Configuration WLCSP ................................................................................................. 10
3.10 Ball Description WLCSP..................................................................................................... 10
4. PIN DESCRIPTIONS ...................................................................................................................... 11
4.1 Chip Select (/CS) ................................................................................................................ 11
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 11
4.3 Write Protect (/WP) ............................................................................................................ 11
4.4 HOLD (/HOLD) ................................................................................................................... 11
4.5 Serial Clock (CLK) .............................................................................................................. 11
5. BLOCK DIAGRAM .......................................................................................................................... 12
6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13
6.1 SPI/QPI OPERATIONS ...................................................................................................... 13
6.1.1 Standard SPI Instructions .....................................................................................................13
6.1.2 Dual SPI Instructions ............................................................................................................13
6.1.3 Quad SPI Instructions...........................................................................................................14
6.1.4 QPI Instructions ....................................................................................................................14
6.1.5 Hold Function .......................................................................................................................14
6.2 WRITE PROTECTION ....................................................................................................... 15
6.2.1 Write Protect Features .........................................................................................................15
7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 16
7.1 STATUS REGISTERS........................................................................................................ 16
7.1.1 BUSY....................................................................................................................................16
7.1.2 Write Enable Latch (WEL)....................................................................................................16
7.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................16
7.1.4 Top/Bottom Block Protect (TB) .............................................................................................16
7.1.5 Sector/Block Protect (SEC) ..................................................................................................16
-2-



Winbond W25Q64FV
W25Q64FV
7.1.6 Complement Protect (CMP)..................................................................................................16
7.1.7 Status Register Protect (SRP1, SRP0).................................................................................17
7.1.8 Erase/Program Suspend Status (SUS) ................................................................................17
7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................17
7.1.10 Quad Enable (QE) ..............................................................................................................17
7.1.11 W25Q64FV Status Register Memory Protection (CMP = 0)...............................................19
7.1.12 W25Q64FV Status Register Memory Protection (CMP = 1)...............................................20
7.2 INSTRUCTIONS................................................................................................................. 21
7.2.1 Manufacturer and Device Identification ................................................................................21
7.2.2 Instruction Set Table 1 (Standard SPI Instructions)(1)...........................................................22
7.2.3 Instruction Set Table 2 (Dual SPI Instructions).....................................................................23
7.2.4 Instruction Set Table 3 (Quad SPI Instructions) ...................................................................23
7.2.5 Instruction Set Table 4 (QPI Instructions)(14) ........................................................................24
7.2.6 Write Enable (06h) ...............................................................................................................26
7.2.7 Write Enable for Volatile Status Register (50h) ....................................................................26
7.2.8 Write Disable (04h)...............................................................................................................27
7.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................27
7.2.10 Write Status Register (01h) ................................................................................................28
7.2.11 Read Data (03h) .................................................................................................................30
7.2.12 Fast Read (0Bh) .................................................................................................................31
7.2.13 Fast Read Dual Output (3Bh) .............................................................................................33
7.2.14 Fast Read Quad Output (6Bh)............................................................................................34
7.2.15 Fast Read Dual I/O (BBh)...................................................................................................35
7.2.16 Fast Read Quad I/O (EBh) .................................................................................................37
7.2.17 Word Read Quad I/O (E7h) ................................................................................................40
7.2.18 Octal Word Read Quad I/O (E3h).......................................................................................42
7.2.19 Set Burst with Wrap (77h) ..................................................................................................44
7.2.20 Page Program (02h) ...........................................................................................................45
7.2.21 Quad Input Page Program (32h) ........................................................................................47
7.2.22 Sector Erase (20h) .............................................................................................................48
7.2.23 32KB Block Erase (52h) .....................................................................................................49
7.2.24 64KB Block Erase (D8h).....................................................................................................50
7.2.25 Chip Erase (C7h / 60h).......................................................................................................51
7.2.26 Erase / Program Suspend (75h) .........................................................................................52
7.2.27 Erase / Program Resume (7Ah) .........................................................................................54
7.2.28 Power-down (B9h) ..............................................................................................................55
7.2.29 Release Power-down / Device ID (ABh) .............................................................................56
7.2.30 Read Manufacturer / Device ID (90h) .................................................................................58
7.2.31 Read Manufacturer / Device ID Dual I/O (92h) ...................................................................59
7.2.32 Read Manufacturer / Device ID Quad I/O (94h) .................................................................60
7.2.33 Read Unique ID Number (4Bh)...........................................................................................61
Publication Release Date: July 18, 2017
- 3 - Revision S







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