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PSHI06

Powersem GmbH

IGBT Module H-Bridge Configuration

ECO-PACTM 2 PSHI 25/06* H-Bridge Configuration Short Circuit SOA Capability Square RBSOA F10 A1 Preliminary Data Sheet ...


Powersem GmbH

PSHI06

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ECO-PACTM 2 PSHI 25/06* H-Bridge Configuration Short Circuit SOA Capability Square RBSOA F10 A1 Preliminary Data Sheet IGBT Module IC25 = 24.5 A VCES = 600 V VCE(sat)typ. = 2.4 V K10 K13 H13 S18 IGBTs Symbol VCES VGES IC25 IC80 I CM VCEK tSC (SCSOA) P tot Symbol TC = 25°C TC = 80°C N9 Conditions TVJ = 25°C to 150°C NTC P18 PSHI 25/06* 600 ± 20 24.5 17 30 VCES 10 82 V V A A A µs W Features Maximum Ratings *NTC optional VGE = ±15 V; RG = 68 Ω; TVJ = 125°C RBSOA, Clamped inductive load; L = 100 µH VCE = VCES; VGE = ±15 V; RG = 68 Ω; TVJ = 125°C non-repetitive TC = 25°C Conditions Characteristic Values (TVJ = 25°C, unless otherwise specified) min. typ. max. 2.4 2.9 2.9 6.5 0.6 2.7 100 VCE(sat) VGE(th) ICES IGES td(on) tr td(off) tf Eon Eoff Cies RthJC RthJH IC = 25 A; VGE = 15 V; TVJ = 25°C TVJ = 125°C IC = 0.4 mA; VGE = VCE VCE = VCES; VGE = 0 V; TVJ = 25°C TVJ = 125°C 4.5 V V V mA mA nA ns ns ns ns mJ mJ nF NPT IGBT technology low saturation voltage low switching losses square RBSOA, no latch up high short circuit capability positive temperature coefficient for easy parallelling MOS input, voltage controlled ultra fast free wheeling diodes solderable pins for PCB mounting package with copper base plate Isolation voltage 3000 V∼ UL registered, E 148688 Advantages space and weight savings reduced protection circuits package designed for wave soldering High power density Easy to mount with two screws VCE = 0 V; VGE = ± 20...




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