IGBT Module H-Bridge Configuration
ECO-PACTM 2 PSHI 25/06* H-Bridge Configuration
Short Circuit SOA Capability Square RBSOA
F10 A1
Preliminary Data Sheet
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Description
ECO-PACTM 2 PSHI 25/06* H-Bridge Configuration
Short Circuit SOA Capability Square RBSOA
F10 A1
Preliminary Data Sheet
IGBT Module
IC25 = 24.5 A VCES = 600 V VCE(sat)typ. = 2.4 V
K10 K13 H13
S18
IGBTs
Symbol VCES VGES IC25 IC80 I CM VCEK tSC (SCSOA) P tot Symbol
TC = 25°C TC = 80°C
N9
Conditions
TVJ = 25°C to 150°C
NTC
P18
PSHI 25/06*
600 ± 20 24.5 17 30 VCES 10 82 V V A A A µs W Features
Maximum Ratings *NTC optional
VGE = ±15 V; RG = 68 Ω; TVJ = 125°C RBSOA, Clamped inductive load; L = 100 µH VCE = VCES; VGE = ±15 V; RG = 68 Ω; TVJ = 125°C non-repetitive TC = 25°C
Conditions
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min.
typ. max.
2.4 2.9 2.9 6.5 0.6 2.7 100
VCE(sat) VGE(th) ICES IGES td(on) tr td(off) tf Eon Eoff Cies RthJC RthJH
IC = 25 A; VGE = 15 V; TVJ = 25°C TVJ = 125°C IC = 0.4 mA; VGE = VCE VCE = VCES; VGE = 0 V; TVJ = 25°C TVJ = 125°C 4.5
V V V mA mA nA ns ns ns ns mJ mJ nF
NPT IGBT technology low saturation voltage low switching losses square RBSOA, no latch up high short circuit capability positive temperature coefficient for easy parallelling MOS input, voltage controlled ultra fast free wheeling diodes solderable pins for PCB mounting package with copper base plate Isolation voltage 3000 V∼ UL registered, E 148688
Advantages space and weight savings reduced protection circuits package designed for wave soldering High power density Easy to mount with two screws
VCE = 0 V; VGE = ± 20...
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