New Product Introduction
NEW! FJ3P02100L & FK3P02110L Series
Power CSP MOSFET’s
With Panasonic’s Advanced 110nm Fine Trench Cell Silicon Technology
Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce the NEW FJ3P02100L and FK3P02110L Series of Power CSP MOSFET’s. The NEW POWER CSP MOSFET Series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have lead to silicon with a 110nm fine trench cell that provides 47% lower RDS(on) over the same sized conventional chip. By using this technology, this MOSFET Series achieves higher power efficiency while reducing power consumption.
Features:
• Power Mount CSP (PMCP) Package Allows For Improved Thermal Dissipation By 5% While Reducing The Size By 80% Over the Conventional Solutions • Employing a Fine Trench Silicon Technology That Provides 47% lower RDS(on) Over The Same Sized Conventional Chip. By Using This Technology, this MOSFET Family Achieves Higher Power Efficiency While Reducing Power Consumption of the System • Size: FJ3P02100L: 2.0 x 2.0 x 0.33mm FK3P02110L: 1.8 x 1.6 x 0.33mm • RDS(on): FJ3P02100L: 9.5mΩ@VGS=4.5V(typ.) FK3P02110L: 12.5mΩ@VGS=2.5V(typ.) • Lead-free Solder Bumps, Halogen Free, RoHS Qualified • AEC-Q101 Qualified
Applications:
• Portable Audio Player/ Gaming Device/ Hand Set/ IC Recorder • Blood Glucose Monitor/ Hearing Aid • IC Card • Meter • Adapter • Smart Phone/ Tablet PC/ E-Book • Sever/Rooter
Part Number Information:
1 2 3 4 5 6 7 8 9 10
F
J
J K
3
Pch Nch
P
PMCP
0
2
1
0
0
L
Taping
Product Code
Product Number
Specification
Benefits:
Code F
Type MOSFET
0210 0211
• High Power Density and Better Efficiency Minimize Board Space While Increasing Efficiency and Thermal Dissipation • Lower Power Consumption Industry Leading Low RDS(on) for Load Switch • Dampen Excessive Ringing and Overshoot The Clip Structure Rather Than Wire-Bonds is More Effective to Reduce the Parasitic Inductance • Portable Application • Medical • Health Care • Mobile • Computing • Consumer
Additional Information:
For detailed specification information on these Power CSP MOSFET Semiconductors, visit: panasonic.com/ industrial/includes/zip/ PCMP_MOSFET_ DataSheet.zip today! Website: panasonic.com/industrial/semiconductors
Industries:
Website: www.panasonic.com/industrial
[email protected] 1-800-344-2112
Copyright © 2013 Panasonic Corporation of North America. All Rights Reserved. Specifications are subject to change without notice. PMCP MOSFET NPI, FY12-132-XXX
.