0404 Balun. BD2425N50ATI Datasheet

BD2425N50ATI Balun. Datasheet pdf. Equivalent


Part BD2425N50ATI
Description Ultra Low Profile 0404 Balun
Feature Model BD2425N50ATI Rev A Ultra Low Profile 0404 Balun for TI transceiver CC2500 50Ω to 127+j34Ω Bal.
Manufacture Anaren Microwave
Datasheet
Download BD2425N50ATI Datasheet


Model BD2425N50ATI Rev A Ultra Low Profile 0404 Balun for T BD2425N50ATI Datasheet
Recommendation Recommendation Datasheet BD2425N50ATI Datasheet




BD2425N50ATI
Model BD2425N50ATI
Rev A
Ultra Low Profile 0404 Balun
for TI transceiver CC2500
50Ω to 127+j34Ω Balanced
(Anaren Application Note Ann-2003)
Description
The BD2425N50ATI is a low cost, low profile sub-miniature unbalanced to
balanced transformer designed for differential inputs and output locations on modern
chipsets in an easy to use surface mount package. The BD2425N50ATI is ideal for
high volume manufacturing and delivers higher performance than traditional ceramic
baluns. The BD2425N50ATI has an unbalanced port impedance of 50and 127+
j34balanced port impedance. This transformation enables single ended signals to
be applied to differential ports on modern integrated chipsets. The output ports have
equal amplitude (-3dB) with 180 degree phase differential. The BD2425N50ATI is
available on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications: Specifications subject to change without notice.
Features:
ROOM (25°C)
2400 – 2500 MHz
0.65mm Height Profile
50 Ohm to 2 x 63.5+j17 Ohm
Parameter
Frequency
Min.
2300
Typ.
Max
2600
Low Insertion Loss
Unbalanced Port Impedance**
50
Surface Mountable
Tape & Reel
Non-conductive Surface
Balanced Port Impedance**
Return Loss**
127+j34
13 17
RoHS Compliant
Insertion Loss* **
0.4 0.6
Zigbee
Power Handling
1 TBD
Operating Temperature
-55
+85
* Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1 dB higher at +85 ºC)
* Stated performance assumes proper matching network found in application note: ANN-2003
Outline Drawing
Unit
MHz
dB
dB
Watts
ºC
Top View (Near-side)
.041+-..000023
[ ]1.05+-00..0068
.041+-..000023
[ ]1.05+-00..0068
Dimensions are in Inches [Millimeters]
Mechanical Outline
Side View
Bottom View (Far-side)
.024±.0025
.012 [0.30]
[0.62±0.064] 0.12 [0.30] 1
2
3x.010
[0.25]
Pin Designation
1
GND / DC Feed
+ RF GND
2 Unbalanced Port
3 Balanced Port
4 Balanced Port
4
4X .020 [0.50]
3
3x.010
[0.25]
Tolerances are Non-Cumulative
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 2392 232392 Fax: (+44) 2392 251369



BD2425N50ATI
Model BD2425N50ATI
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances
3X .011
[0.29]
.008 [0.21]
3X .011
[0.29]
With DC Bias
Plated thru
hole to
ground
.014 [0.36]
.020
[0.50]
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
.008 [0.21]
.020
[0.50]
Dimensions are in Inches [Millimeters]
Mounting Footprint
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 2392 232392 Fax: (+44) 2392 251369







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)