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HD6433866 Dataheets PDF



Part Number HD6433866
Manufacturers Renesas Technology
Logo Renesas Technology
Description single-chip microcomputers
Datasheet HD6433866 DatasheetHD6433866 Datasheet (PDF)

H8/3867 Series H8/3867 H8/3866 H8/3865 H8/3864 H8/3863 H8/3862 HD6473867, HD6433867 HD6433866 HD6433865 HD6433864 HD6433863 HD6433862 H8/3827 Series H8/3827 H8/3826 H8/3825 H8/3824 H8/3823 H8/3822 HD6473827, HD6433827 HD6433826 HD6433825 HD6433824 HD6433823 HD6433822 Hardware Manual ADE-602-142B Rev. 3 3/15/03 Hitachi Ltd. The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checke.

  HD6433866   HD6433866


Document
H8/3867 Series H8/3867 H8/3866 H8/3865 H8/3864 H8/3863 H8/3862 HD6473867, HD6433867 HD6433866 HD6433865 HD6433864 HD6433863 HD6433862 H8/3827 Series H8/3827 H8/3826 H8/3825 H8/3824 H8/3823 H8/3822 HD6473827, HD6433827 HD6433826 HD6433825 HD6433824 HD6433823 HD6433822 Hardware Manual ADE-602-142B Rev. 3 3/15/03 Hitachi Ltd. The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. List of Items Revised or Added for This Version Page 1 2 3 5 8 13 88 89 91 92 95 97 99 100 102 104 107 Item Table 1.1 Features / CPU Table 1.1 Features / Clock pulse generators Table 1.1 Features / LCD drive power supply Figure 1.1 Block Diagram Description Change in (2) High-speed calculation specification Change in specification Addition Modification Table 1.2 Pin Functions / Power source pin Modification of stabilization capacitance 2.1.1 Features Figure 4.2 Typical Connection to Crystal Oscillator Figure 4.4 Typical Connection to Ceramic Oscillator Figure 4.7 Typical Connection to 32.768kHz/38.4 kHz Crystal Oscillator (Subclock) Change in High-speed operation Addition of recommended value Addition of recommended value Addition of description Figure 4.9 Pin Connection when not Using Modification Subclock Table 5.1 Operating Modes Modification of subsleep mode/watch mode descriptions Table 5.2 Internal State in Each Operating Modification of Note 4 Mode 5.1.1 System Control Registers 1. System control register 1 (SYSCR1) 2. System control register 2 (SYSCR2) 5.2 Sleep Mode Addition of Notes to Bits 6 to 4 Modification of Bit 4 contents Addition of description 5.3.3 Oscillator Settling Timer after Stanby Addition of description Mode is Cleared 5.5.2 Clearing Subsleep Mode • Clearing by interrupt Addition of description 109 147 226 248 251 5.7.1 Transition to Active (Medium-Speed) Addition of description Mode Table 8.10 Port 3 Pin States Table 9.13 Timer G Operation Modes 9.7.5 Application Notes Figure 10.1 SCI3 Block Diagram Modification Addition of description in Notes Addition and modification of descriptions Modification Page 256 265 266 267 268 303 357 360 to 362 363 to 368 369 to 370 371 372 373 376 377 Item Description 10.2.5 Serial Mode Register (SMR) / Bits 1 Addition of description in Notes and 0 Table 10.4 Relation between n and Clock Table 10.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode) Table 10.7 Relation between n and Clock 10.2.9 Clock Stop Register 1 (CKSTPR1) 10.5 Application Notes 14.2 When Using the Internal Power Supply Step-Down Circuit 15.2.1 Power Supply Voltage and Operating Range Table 15.2 DC Characteristics Table 15.3 Control Signal Timing Table 15.4 Serial Interface (SCI3-1, SCI3-2) Timing Table 15.5 A/D Converter Characteristics Addition of description in Notes Modification of Notes Addition of descriptio.


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