R5F212DCSNXXXFP Datasheet (data sheet) PDF





R5F212DCSNXXXFP Datasheet, MCU

R5F212DCSNXXXFP   R5F212DCSNXXXFP  

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R8C/2C Group, R8C/2D Group RENESAS MCU REJ03B0183-0210 Rev.2.10 Dec 05, 2007 1. 1.1 Overview Features The R8C/2C G roup and R8C/2D Group of single-chip MC Us incorporates the R8C/Tiny Series CPU core, employing sophisticated instruct ions for a high level of efficiency. Wi th 1 Mbyte of address space, and it is capable of executing instructions at hi gh speed. In addition, the CPU core boa sts a multiplier for high-speed operati on processing. Power consumption is low , and the supported operating modes all ow additional power control. These MCUs also use an anti-noise configuration t o reduce emissions of electromagnetic n oise and are designed to

R5F212DCSNXXXFP Datasheet, MCU

R5F212DCSNXXXFP   R5F212DCSNXXXFP  
withstand EMI. Integration of many perip heral functions, including multifunctio n timer and serial interface, reduces t he number of system components. Further more, the R8C/2D Group has on-chip data flash (1 KB × 2 blocks). The differen ce between the R8C/2C Group and R8C/2D Group is only the presence or absence o f data flash. Their peripheral function s are the same. 1.1.1 Applications E lectronic household appliances, office equipment, audio equipment, consumer eq uipment, etc. Rev.2.10 Dec 05, 2007 RE J03B0183-0210 Page 1 of 57 R8C/2C Gro up, R8C/2D Group 1. Overview 1.1.2 S pecifications Tables 1.1 and 1.2 outli nes the Specifications for R8C/2C Group and Tables 1.3 and 1.4 outlines the Sp ecifications for R8C/2D Group. Table 1. 1 Item CPU Specifications for R8C/2C G roup (1) Function Central processing un it Specification R8C/Tiny series core Number of fundamental instructions: 89 • Minimum instruction execution ti me: 50 ns (f(XIN) = 20 MHz, VCC = 3.0 t o 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) 200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) • Multiplier: 16 bits × 16 bits → 32 bits • Multipl y-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits • Operati on mode: Single-chip mode (address spac e: 1 Mbyte) Refer to Table 1.5 Product List for R8C/2C Group. • Powe








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