Document
AP2306AGEN-HF
Halogen-Free Product
Advanced Power Electronics Corp.
▼ Capable of 2.5V Gate Drive ▼ Small Outline Package ▼ Surface Mount Device ▼ RoHS Compliant & Halogen-Free
SOT-23 D
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON)
S G
30V 50mΩ 4.1A
ID
Description
Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and costeffectiveness device. The SOT-23 package is widely used for commercial-industrial applications.
D G S
Absolute Maximum Ratings
Symbol VDS VGS ID@TA=25℃ ID@TA=70℃ IDM PD@TA=25℃ TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current , VGS @ 4.5V Continuous Drain Current , VGS @ 4.5V Pulsed Drain Current
1 3 3
Rating 30 +6 4.1 3.3 16 1.38 -55 to 150 -55 to 150
Units V V A A A W ℃ ℃
Total Power Dissipation Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient
3
Value 90
Unit ℃/W 1 201208081
Data and specifications subject to change without notice
AP2306AGEN-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance2 Test Conditions VGS=0V, ID=250uA VGS=4.5V, ID=4A VGS=2.5V, ID=3A Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current Gate-Source Leakage Total Gate Charge Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS=VGS, ID=250uA VDS=10V, ID=3A VDS=30V, VGS=0V VGS=+6V, VDS=0V ID=3A VDS=15V VGS=4.5V VDS=15V ID=1A RG=3.3Ω VGS=5V VGS=0V VDS=25V f=1.0MHz Min. 30 0.5 Typ. 15 8.7 1.3 3.5 65 130 470 290 610 60 50 Max. Units 50 72 1.5 10 +30 14 1000 V mΩ mΩ V S uA uA nC nC nC ns ns ns ns pF pF pF
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2
Test Conditions IS=1.2A, VGS=0V IS=6A, VGS=0V, dI/dt=100A/µs
Min. -
Typ. 220 600
Max. Units 1.2 V ns nC
Reverse Recovery Time Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board ; 270℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.
2
AP2306AGEN-HF
20 16
T A = 25 o C
16
ID , Drain Current (A)
ID , Drain Current (A)
5.0V 4.5V 3.5V 2.5V
TA=150 C
o
12
5.0V 4.5V 3.5V 2.5V
12
8
8
V G = 2.0 V
4
V G = 2.0 V
4
0 0.0 2.0 4.0 6.0 8.0 10.0
0 0.0 2.0 4.0 6.0 8.0
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
70
2.0
I D =3A T A =25 o C
60 1.6
I D =4A V G =4.5V Normalized RDS(ON)
RDS(ON) (mΩ)
50
1.2
40
0.8
30 0 2 4 6 8
0.4 -50 0 50 100 150
V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
2.0
4.0
3.0
1.5
2.0
T j =150 o C
T j =25 o C
Normalized VGS(th) (V)
IS(A)
1.0
1.0
0.5
0.0 0 0.2 0.4 0.6 0.8 1 1.2
0.0 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
3
AP2306AGEN-HF
f=1.0MHz
8
800
I D =3A VGS , Gate to Source Voltage (V)
6
4
C (pF)
V DS =15V V DS =18V V DS =24V
600
C iss
400
2
200
0
0 0.0 4.0 8.0 12.0 16.0 1 5 9 13 17 21 25
C oss C rss
29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
10
Normalized Thermal Response (Rthja)
Duty factor=0.5
0.2
100us ID (A)
1
0.1
0.1
PDM t
0.05
1ms 10ms
0.1
T
Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja = 270 ℃ /W
0.02
T A =25 C Single Pulse
0.01 0.1 1 10
o
100ms 1s DC
100
0.01 Single Pulse
0.01 0.0001 0.001 0.01 0.1 1 10 100
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG
QG
4.5V QGS
QGD
10% VGS td(on) tr td(off) tf
Charge
Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Circuit
4
.