Document
AP96T07GP-HF
RoHS-compliant Product
Advanced Power Electronics Corp.
▼ Simple Drive Requirement ▼ Lower On-resistance ▼ Fast Switching Characteristic ▼ RoHS Compliant & Halogen-Free G
N-CHANNEL ENHANCEMENT MODE POWER MOSFET D
BVDSS RDS(ON) ID
75V 4.2mΩ 120A
S
Description
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is widely preferred for commercial-industrial through-hole applications. G
D
TO-220(P)
S
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25℃ ID@TC=25℃ ID@TC=100℃ IDM PD@TC=25℃ TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (Chip) Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current
1 3 3
Rating 75 +20 180 120 120 480 300 -55 to 175 -55 to 175
Units V V A A A A W ℃ ℃
Total Power Dissipation Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case Maixmum Thermal Resistance, Junction-ambient Value 0.5 62 Units ℃/W ℃/W
Data and specifications subject to change without notice
1 200911042
AP96T07GP-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance2 Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current Gate-Source Leakage Total Gate Charge
2
Test Conditions VGS=0V, ID=250uA VGS=10V, ID=40A VDS=VGS, ID=250uA VDS=10V, ID=40A VDS=75V, VGS=0V VGS= +20V, VDS=0V ID=40A VDS=60V VGS=10V VDS=40V ID=40A RG=3.3Ω,VGS=10V RD=1Ω VGS=0V VDS=25V f=1.0MHz f=1.0MHz
Min. 75 2 -
Typ. 90 92 16 48 18 90 40 80 1000 270 1.4
Max. Units 4.2 4 25 +100 150 2.1 V mΩ V S uA nA nC nC nC ns ns ns ns pF pF pF Ω
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
3500 5600
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2 2
Test Conditions IS=40A, VGS=0V IS=10A, VGS=0V dI/dt=100A/µs
Min. -
Typ. 70 180
Max. Units 1.3 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Package limitation current is 120A.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.
2
AP96T07GP-HF
300
160
T C = 25 C
250
o
ID , Drain Current (A)
ID , Drain Current (A)
10V 8.0V 7.0V 6.0V
T C = 175 o C
120
10V 8.0V 7.0V 6.0V
200
V GS =5.0V
80
150
100
V GS =5.0V
50
40
0 0 2 4 6 8 10
0
0 2 4 6 8
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
8
2.4
I D =30A
7
T C =25 o C
2.0
I D =40A V G =10V Normalized RDS(ON)
RDS(ON) (mΩ)
6
1.6
5
1.2
4
0.8
3
2 4 5 6 7 8 9 10
0.4 -50 0 50 100 150 200
V GS Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.6
40
Normalized VGS(th) (V)
1.2
30
1.2
IS(A)
T j =175 o C
20
T j =25 o C
0.8
10
0.4
0 0 0.2 0.4 0.6 0.8 1
0.0 -50 0 50 100 150 200
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
3
AP96T07GP-HF
12 5000
f=1.0MHz
I D = 40 A
VGS , Gate to Source Voltage (V)
10
V DS =40V V DS =45V V DS =60V C (pF)
4000
8 3000
C iss
6
2000 4
1000 2
C oxx C rss
1 5 9 13 17 21 25 29
0 0 20 40 60 80 100 120
0
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
1
Normalized Thermal Response (Rthjc)
Duty factor=0.5
Operation in this area limited by RDS(ON)
100
100us
0.2
ID (A)
1ms 10ms
10
0.1
0.1
0.05
PDM
0.02
t T
T c =25 C Single Pulse
1
o
100ms DC
0.01
Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
0.01
0.1
1
10
100
0.00001
0.0001
0.001
0.01
0.1
1
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG QG 10V QGS QGD
10% VGS td(on) tr td(off) tf Charge Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge.