MOSFET
STT6602
Elektronische Bauelemente N-Ch: 3.3A, 30V, RDS(ON) 65 mΩ P-Ch: -2.3A, -30V, RDS(ON) 120 mΩ N & P-Channel Enhance...
Description
STT6602
Elektronische Bauelemente N-Ch: 3.3A, 30V, RDS(ON) 65 mΩ P-Ch: -2.3A, -30V, RDS(ON) 120 mΩ N & P-Channel Enhancement Mode Mos.FET
RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
The STT6602 uses advanced trench technology to provide excellent on-resistance and low gate charge. The complementary MOSFETs form a high-speed power inverter, suitable for a multitude of applications. The TSOP-6 package is universally used for all commercial-industrial surface mount applications.
A E
TSOP-6
L
6 5 4
B
FEATURES
Low Gate Change Low On-resistance
1
2
3
F DG K
C
H J
MARKING
REF.
6602
Date Code
A B C D E F
Millimeter Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.10 MAX. 1.90 REF. 0.30 0.50
REF. G H J K L
Millimeter Min. Max. 0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF.
PACKAGE INFORMATION
Package TSOP-6 MPQ 3K Leader Size 7 inch
TOP VIEW
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Ratings Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current
1 2
Symbol
VDS VGS TA=25° C TA=70° C ID IDM PD
N-Channel
Unit
P-Channel
30 ±20 3.3 2.6 10 1.14 0.01
-30 ±20 -2.3 -1.8 -10
V V A A W W/° C ° C
Power Dissipation @TA=25° C Linear Derating Factor Operating Junction and Storage Temperature Range
TJ, TSTG
-55~150
Thermal Resistance Rating
Maximum Junction to Ambient
2
RθJA
110
° C/W
Notes: 1. Pulse width limited by Max. junction temperature. 2. Surface mounted on 1 in2 copper...
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