HEXFET Power MOSFET
IRFH5303PbF
HEXFET® Power MOSFET VDS RDS(on) max
(@VGS = 10V)
30 4.2 15 0.6 82
V m
:
Qg (typical) RG (typical) ID
n...
Description
IRFH5303PbF
HEXFET® Power MOSFET VDS RDS(on) max
(@VGS = 10V)
30 4.2 15 0.6 82
V m
:
Qg (typical) RG (typical) ID
nC
:
A
(@Tc(Bottom) = 25°C)
PQFN 5X6 mm
Applications
Control MOSFET for high frequency buck converters
Features and Benefits
Features Benefits
Low charge (typical 15nC) Low Rg (typical 0.6 Ω) Low Thermal Resistance to PCB (<2.7°C/W) 100% Rg tested Low Profile (<0.9 mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Industrial Qualification
Lower Switching Losses Lower Switching Losses Increased Power Density Increased Reliability results in Increased Power Density ⇒ Multi-Vendor Compatibility Easier Manufacturing Environmentally Friendlier Increased Reliability
Orderable part number IRFH5303TRPBF IRFH5303TR2PBF
Package Type PQFN 5mm x 6mm PQFN 5mm x 6mm
Standard Pack Form Tape and Reel Tape and Reel Quantity 4000 400
Note
EOL notice # 259
Absolute Maximum Ratings
VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C IDM PD @TA = 25°C PD @ TC(Bottom) = 25°C TJ TSTG Parameter Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Max. 30 ± 20 23 18 82 52 330 3.6 46 0.029 -55 to + 150 Units V
A
g g
c
W W/°C °C
Linear Derating Fac...
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