HEXFET Power MOSFET
VDS RDS(on) max
(@VGS = 10V)
Qg (typical) RG (typical)
ID
(@Tc(Bottom) = 25°C)
30 8.1
7.8 1.4 44
Applications • Contro...
Description
VDS RDS(on) max
(@VGS = 10V)
Qg (typical) RG (typical)
ID
(@Tc(Bottom) = 25°C)
30 8.1
7.8 1.4 44
Applications Control MOSFET for buck converters
V mΩ nC Ω
A
IRFH5306PbF
HEXFET® Power MOSFET
PQFN 5X6 mm
Features and Benefits
Fe a ture s Low charge (typical 7.8nC) Low thermal resistance to PCB (< 4.9°C/W) 100% Rg tested Low profile (< 0.9 mm)
Industry-standard pinout Compatible with existing Surface Mount Techniques RoHS compliant containing no lead, no bromide and no halogen MSL1, Industrial qualification
results in
⇒
Be ne fi ts Lower switching losses Increased power density Increased reliability Increased power density
Multi-vendor compatibility Easier manufacturing Environmentally friendly Increased reliability
Orderable part number
Package Type
IRFH5306TRPBF IRFH5306TR2PBF
PQFN 5mm x 6mm PQFN 5mm x 6mm
Standard Pack
Form
Quantity
Tape and Reel
4000
Tape and Reel
400
Note EOL notice #259
Absolute Maximum Ratings
Parameter
VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C IDM PD @TA = 25°C PD @ TC(Bottom) = 25°C
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V
cContinuous Drain Current, VGS @ 10V
Pulsed Drain Current
gPower Dissipation gPower Dissipation gLinear Derating Factor
TJ Operating Junction and
TSTG
Storage Temperature Range
Max. 30 ±20 15 13 44 28 60 3.6 26
0.029 -55 to + 150
Units V
A
W W/°C
°C
...
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