HEXFET Power MOSFET
IRFH8316PbF
VDS Vgs max RDS(on) max
(@VGS = 10V)
(@VGS = 4.5V)
Qg typ
ID
(@Tc(Bottom) = 25°C)
30 ± 20
2.95
4.30 30.0
5...
Description
IRFH8316PbF
VDS Vgs max RDS(on) max
(@VGS = 10V)
(@VGS = 4.5V)
Qg typ
ID
(@Tc(Bottom) = 25°C)
30 ± 20
2.95
4.30 30.0
50i
V V
mΩ
nC A
HEXFET® Power MOSFET
PQFN 5X6 mm
Applications Synchronous MOSFET for high frequency buck converters
Features and Benefits
Features Low Thermal Resistance to PCB (< 1.7°C/W) Low Profile (<1.2mm)
Industry-Standard Pinout Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Consumer Qualification
Benefits Enable better thermal dissipation results in Increased Power Density
⇒ Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier Increased Reliability
Orderable part number
IRFH8316TRPBF IRFH8316TR2PBF
Package Type
PQFN 5mm x 6mm PQFN 5mm x 6mm
Standard Pack Form Tape and Reel Tape and Reel
Quantity 4000 400
Note EOL notice # 259
Absolute Maximum Ratings
Parameter
VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C ID @ TC = 25°C IDM PD @TA = 25°C PD @TC(Bottom) = 25°C
Drain-to-Source Voltage Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V
cContinuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
gPower Dissipation gPower Dissipation gLinear Derating Factor
TJ TSTG
Operating Junction and Storage Temperature Range
Max. 30 ± 20 27 21
120hi 78hi 50i
490 3.6 59
0.029 -55 to + 150
Un...
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