(FFM101G - FFM107G) 1.0A Surface Mount Fast Recovery Rectifiers
Chip Silicon Rectifier
FFM101G THRU FFM107G
1.0A Surface Mount Fast Recovery Rectifiers-50-1000V
Features
• Batch proc...
Description
Chip Silicon Rectifier
FFM101G THRU FFM107G
1.0A Surface Mount Fast Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM101G-H.
Mechanical data
Epoxy:UL94-V0 rated flame retardant Case : Molded plastic, JEDEC DO-214AC / SMA Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated 0.05 gram
Package outline SMA
0.196(4.9) 0.180(4.5)
0.012(0.3) Typ.
0.106(2.7) 0.091(2.3)
0.032(0.8) Typ.
0.068(1.7) 0.060(1.5)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
Maximum ratings (AT TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward rectified current
Ambient temperature = 75oC
Forward surge current
Reverse current Thermal resistance Diode junction capacitance Storage temperature
8.3ms single half sine-wave superimposed on rate load (JEDEC methode)
VR = VRRM TJ = 25OC VR = VRRM TJ = 100OC Junction to ambient
f=1MHz and applied 4V DC reverse voltage
Symbol MIN. TYP. MAX. UNIT IO 1.0 A
IFSM 30 A
5.0
IR
μA 100
RθJA
42 OC/W
CJ 15 pF
TSTG
-65
+175 OC
SY...
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