(FFM301G - FFM307G) 3.0A Surface Mount Fast Recovery Rectifiers
Chip Silicon Rectifier
3.0A Surface Mount Fast Recovery Rectifiers-50-1000V
Features
• Batch process design, excellent p...
Description
Chip Silicon Rectifier
3.0A Surface Mount Fast Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead- free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM301-MG-H.
Mechanical data
Epoxy: UL94-V0 rated frame retardant Case: Molded plastic, DO-214AB / SMC Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: lndicated by cathode band Mounting Position: Any Weight: Approximated 0.19 gram
FFM301G THRU FFM307G
Package outline SMC
0.272(6.9) 0.248(6.3)
0.012(0.3) Typ.
0.189(4.8) 0.165(4.2)
0.048(1.2) Typ.
0.098(2.5) 0.075(1.9)
0.048 (1.2) Typ.
Dimensions in inches and (millimeters)
Maximum ratings (AT TA=25oC unless otherwise noted)
PARAMETER Forward rectified current
CONDITIONS Ambient temperature = 55oC
Forward surge current
Reverse current Thermal resistance Diode junction capacitance Storage temperature
8.3ms single half sine-wave superimposed on rate load (JEDEC methode)
VR = VRRM TJ = 25OC VR = VRRM TJ = 100OC Junction to ambient
f=1MHz and applied 4V DC reverse voltage
Symbol IO
IFSM
MIN.
TYP.
MAX. UNIT 3.0 A
100 A
5.0
IR
μA 300
RθJA CJ
50 OC/W 60 pF
TSTG
-65
+175 OC
SYMBOLS
V...
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