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TL1L2-WH1 Dataheets PDF



Part Number TL1L2-WH1
Manufacturers Toshiba
Logo Toshiba
Description LED Lamps
Datasheet TL1L2-WH1 DatasheetTL1L2-WH1 Datasheet (PDF)

LED Lamps InGaN and Phosphor TL1L2-WH1,L 1. Applications • General Lighting 2. Features (1) Size: 3.5 (L) mm × 3.5 (W) mm × 1.93 (H) mm (2) High luminous flux LED: 120 lm (typ.) @IF = 350 mA (3) Color: White (color temperature: 4000 K (typ.)) (4) High Color Rendering Index : Ra = 80 (min) (5) Operating temperature range: Topr = -40 to 100  (6) Reflow-soldering is available. 3. Packaging and Pin Assignment 4-4M1 TL1L2-WH1,L 1: Anode 2: Cathode Start of commercial production 2014-03 1 2014-04-2.

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LED Lamps InGaN and Phosphor TL1L2-WH1,L 1. Applications • General Lighting 2. Features (1) Size: 3.5 (L) mm × 3.5 (W) mm × 1.93 (H) mm (2) High luminous flux LED: 120 lm (typ.) @IF = 350 mA (3) Color: White (color temperature: 4000 K (typ.)) (4) High Color Rendering Index : Ra = 80 (min) (5) Operating temperature range: Topr = -40 to 100  (6) Reflow-soldering is available. 3. Packaging and Pin Assignment 4-4M1 TL1L2-WH1,L 1: Anode 2: Cathode Start of commercial production 2014-03 1 2014-04-21 Rev.2.0 TL1L2-WH1,L 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Rating Unit Forward current (DC) See Fig. 4.1. IF 1000 mA Forward current (pulsed) IFP (Note 1) 1200 Power dissipation PD 3.3 W Operating temperature Topr -40 to 100  Storage temperature Tstg -40 to 100 Junction temperature Tj 130 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width 10 ms, duty = 1/10 Fig. 4.1 IF - Ta (Note) Note: The junction-to-ambient thermal resistance, Rth(j-a), should be kept below 20 /W so that this product is not exposed to a condition beyond the absolute maximum ratings. Rth(j-a): Thermal resistance from the LED junction to ambient temperature 2 2014-04-21 Rev.2.0 TL1L2-WH1,L 5. Handling Precautions • This product is sensitive to electrostatic and care must be fully taken when handling products. Particularly in the case that an overvoltage shall be applied, the overflowed energy may cause damage to or possibly result in destruction of the product. Users shall take absolutely secure countermeasures against electrostatic and surge when handling the product. • A damage to the device might create a tiny leakage path, which causes the LED lamp not to light up in the low-current region or causes a drop in the VF rise voltage. Failure criterion: IF ≥ 0.5 mA @ VF = 2 V • If multiple LEDs are connected in parallel, they will experience variations in the forward current due to the characteristics differences in forward voltage. Ensure that the forward current of all the LEDs fall within the intended range of the system design, for example, by inserting current-limiting resistors to each LED string. • Since this product is intended to be used for display lighting, the measurement standard is based on the spectral sensitivity of the human eye. It is not intended to be used for any applications other than display lighting (e.g., sensors and light communications systems.) • Generally, GaN-based LEDs exhibit instability or significant device-to-device variations in the relative luminous flux in the low-current region. To avoid these problems, an application system should be designed in such a manner that the GaN-based LEDs are driven with a forward current of 10 mA or higher. • This device should not be reverse-biased. • When the device is used in places that are likely to be exposed to condensation, salt or corrosive gas, the effect on its performance and reliability must be thoroughly verified. • Please note the handling of products during evaluation. (1) Please do not apply pressure to the upper surface of the product with finger, tweezers, and others. Failure of product to light up may occur due to package deformation, wire deformation and/or disconnection. (2) Should tweezers be used in product handling, one with flat surfaces is recommended. (3) Please handle the product widthwise. (4) Please do not drop the product. There is a possibility for package transformation etc. to occur when the product is dropped. (5) Please do not stack the printed circuit boards on which the product is mounted to prevent damages to product surface. Also, please note not to damage the surface of the product with cushioning material etc. Surface damage to the product may influence their optical characteristics. (6) Solder, flux, paper or heat-sensitive materials that might be deformed or discolored at high temperatures should not be left on the surface of an LED lamp. • Extreme care should be exercised when using this device for high-power applications: (1) Do not directly touch this device during active operation because it becomes hot, depending on the operating power. (2) Take a possible rise in ambient temperature around this device and the heat-resistant temperature of the system components into consideration. 3 2014-04-21 Rev.2.0 6. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characte.


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