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CIM10J301 Dataheets PDF



Part Number CIM10J301
Manufacturers Samsung
Logo Samsung
Description Chip Bead
Datasheet CIM10J301 DatasheetCIM10J301 Datasheet (PDF)

Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCB.

  CIM10J301   CIM10J301


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Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no. CIB10P100 CIB10P220 CIB10P260 CIB10P300 CIB10P330 CIM10U800 CIM10U121 CIM10U221 CIM10U241 CIM10U301 CIM10U471 CIM10U601 CIM10U102 CIM10U202 CIB10J300 CIM10J400 CIM10J470 CIM10J600 CIM10J750 CIM10J800 CIM10J121 CIM10J151 CIM10J221 CIM10J241 Thickness (mm) 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 Impedance (Ω)±25%@100MHz 10 22 26 30 33 80 120 220 240 300 470 600 1000 2000(at 70MHz) 30 40 47 60 75 80 120 150 220 240 DC Resistance (Ω) Max. 0.05 0.05 0.08 0.08 0.08 0.10 0.15 0.25 0.25 0.30 0.35 0.38 0.50 1.20 0.10 0.12 0.12 0.12 0.15 0.15 0.20 0.20 0.30 0.30 Rated Current (mA) Max. 1000 1500 1000 1000 1000 600 500 400 400 400 300 500 400 200 1000 600 600 600 550 550 500 400 400 400 Part no. CIM10J301 CIM10J471 CIM10J601 CIM10J751 CIM10J102 CIM10J152 CIM10J252 CIM10K152 CIM10K202 CIM10K252 CIM10N700 CIM10N121 CIM10N241 CIM10F470 CIM10F600 CIM10F121 CIM10F331 CIM10F471 Thickness (mm) 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 Impedance (Ω)±25%@100MHz 300 470 600 750 1000 1500 2500 1500 2000 2500 70 120 240 47 60 120 330 470 DC Resistance (Ω) Max. 0.35 0.35 0.45 0.50 0.60 0.70 1.50 0.80 1.00 1.20 0.30 0.45 0.60 0.25 0.25 0.30 0.58 0.85 Ver 201208 Rated Current (mA) Max. 400 300 300 300 250 250 200 250 200 200 500 400 300 550 550 500 400 300 CHARACTERISTIC DATA Ver 201208 Ver 201208 Ver 201208 PRODUCT IDENTIFICATION CI M 10 U 121 N C (1) (2) (3) (4) (5) (6) (7) (1) Chip Beads (2) M: Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications. .


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