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dsPIC33EV64GM104 Dataheets PDF



Part Number dsPIC33EV64GM104
Manufacturers Microchip
Logo Microchip
Description Flash Programming Specification
Datasheet dsPIC33EV64GM104 DatasheetdsPIC33EV64GM104 Datasheet (PDF)

dsPIC33EVXXXGM00X/10X dsPIC33EVXXXGM00X/10X Flash Programming Specification 1.0 DEVICE OVERVIEW This document defines the programming specification for the dsPIC33EVXXXGM00X/10X 16-bit Digital Signal Controller (DSC) families. This programming specification is required only for those developing programming support for the following devices: • dsPIC33EV64GM002 • dsPIC33EV64GM004 • dsPIC33EV64GM006 • dsPIC33EV64GM102 • dsPIC33EV64GM104 • dsPIC33EV64GM106 • dsPIC33EV256GM002 • dsPIC33EV256GM004.

  dsPIC33EV64GM104   dsPIC33EV64GM104



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dsPIC33EVXXXGM00X/10X dsPIC33EVXXXGM00X/10X Flash Programming Specification 1.0 DEVICE OVERVIEW This document defines the programming specification for the dsPIC33EVXXXGM00X/10X 16-bit Digital Signal Controller (DSC) families. This programming specification is required only for those developing programming support for the following devices: • dsPIC33EV64GM002 • dsPIC33EV64GM004 • dsPIC33EV64GM006 • dsPIC33EV64GM102 • dsPIC33EV64GM104 • dsPIC33EV64GM106 • dsPIC33EV256GM002 • dsPIC33EV256GM004 • dsPIC33EV256GM006 • dsPIC33EV256GM102 • dsPIC33EV256GM104 • dsPIC33EV256GM106 • dsPIC33EV128GM002 • dsPIC33EV128GM004 • dsPIC33EV128GM006 • dsPIC33EV128GM102 • dsPIC33EV128GM104 • dsPIC33EV128GM106 Customers only using these devices for application development should use development tools that already provide support for device programming. Topics covered include: • Section 1.0 “Device Overview” • Section 2.0 “Programming Overview” • Section 3.0 “Device Programming – ICSP” • Section 4.0 “Device Programming – Enhanced ICSP” • Section 5.0 “Programming the Programming Executive to Memory” • Section 6.0 “The Programming Executive” • Section 7.0 “Device ID” • Section 8.0 “Checksum Computation” • Section 9.0 “AC/DC Characteristics and Timing Requirements” 2.0 PROGRAMMING OVERVIEW There are two methods of programming that are discussed in this programming specification: • In-Circuit Serial Programming™ (ICSP™) • Enhanced In-Circuit Serial Programming The ICSP programming method is the most direct method to program the device; however, it is also the slower of the two methods. It provides native, low-level programming capability to erase, program and verify the device. The Enhanced ICSP protocol uses a faster method that takes advantage of the Programming Executive (PE), as illustrated in Figure 2-1. The PE provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program a dsPIC33EVXXXGM00X/10X device without dealing with the low-level programming protocols. FIGURE 2-1: PROGRAMMING SYSTEM OVERVIEW FOR ENHANCED ICSP™ dsPIC33EVXXXGM00X/10X Programmer Programming Executive On-Chip Memory This programming specification is divided into two major sections that describe the programming methods independently. Section 3.0 “Device Programming – ICSP” describes the ICSP method. Section 4.0 “Device Programming – Enhanced ICSP” describes the Enhanced ICSP method.  2013-2014 Microchip Technology Inc. DS70005137C-page 1 dsPIC33EVXXXGM00X/10X 2.1 Required Connections These devices require specific connections for programming to take place. These connections include power, VCAP, MCLR and one programming pin pair (PGEDx/PGECx). Table 2-1 describes these connections (refer to the specific device data sheet for pin descriptions and power connection requirements). 2.2 Power Requirements All dsPIC33EVXXXGM00X/10X devices, power their core digital logic at a nominal 1.8V. All devices in the dsPIC33EVXXXGM00X/10X families incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the VDD pins. A low-ESR capacitor (such as ceramic or tantalum) must be connected to the VCAP pin (see Figure 2-2 and Table 2-1). This maintains the stability of the regulator. The specifications for core voltage and capacitance are listed in Section 9.0 “AC/DC Characteristics and Timing Requirements”. FIGURE 2-2: CONNECTIONS FOR THE ON-CHIP REGULATOR 5.0V CEFC (10 F typ) dsPIC33EVXXXGM0XX/10X VDD AVDD VCAP VSS AVSS TABLE 2-1: PINS USED DURING PROGRAMMING Pin Name Pin Type Pin Description MCLR VDD and AVDD(1) VSS and AVSS(1) I Programming Enable P Power Supply(1) P Ground(1) VCAP P CPU Logic Filter Capacitor Connection PGECx I Programming Pin Pair: Serial Clock PGEDx I/O Programming Pin Pair: Serial Data Legend: I = Input O = Output P = Power Note 1: All power supply and ground pins must be connected, including AVDD and AVSS. DS70005137C-page 2  2013-2014 Microchip Technology Inc. dsPIC33EVXXXGM00X/10X 2.3 Pin Diagrams Figure 2-3 through Figure 2-5 provide the pin diagrams for the dsPIC33EVXXXGM00X/10X families. The pins that are required for programming are listed in Table 2-1 and are indicated in bold text in the figures. Refer to the appropriate device data sheet for complete pin descriptions. 2.3.1 PGECx AND PGEDx PIN PAIRS All devices in the dsPIC33EVXXXGM00X/10X families have three separate pairs of programming pins, labeled as PGEC1/PGED1, PGEC2/PGED2 and PGEC3/ PGED3. Any one of these pin pairs may be used for device programming by either ICSP or Enhanced ICSP. Unlike voltage supply and ground pins, it is not necessary to connect all three pin pairs to program the device. However, the programming method must use both pins of the same pair. FIGURE 2-3: PIN DIAGRAMS 28-Pin SPDIP/SOIC/SSOP MCLR RA0 RA1 PGED3/OA2IN-/AN2/C2IN1-/SS1/RPI32/CTED2/RB0 PGEC3/OA1OUT.


dsPIC33EV64GM102 dsPIC33EV64GM104 dsPIC33EV64GM106


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