operational amplifiers. TSV911A Datasheet

TSV911A amplifiers. Datasheet pdf. Equivalent

TSV911A Datasheet
Recommendation TSV911A Datasheet
Part TSV911A
Description rail-to-rail input/output 8 MHz operational amplifiers
Feature TSV911A; TSV91x, TSV91xA Single, dual and quad rail-to-rail input/output 8 MHz operational amplifiers Featur.
Manufacture STMicroelectronics
Datasheet
Download TSV911A Datasheet




STMicroelectronics TSV911A
TSV91x, TSV91xA
Single, dual, and quad rail-to-rail input/output 8 MHz operational
amplifiers
Datasheet - production data
Features
Rail-to-rail input and output
Wide bandwidth
Low power consumption: 820 µA typ
Unity gain stability
High output current: 35 mA
Operating from 2.5 V to 5.5 V
Low input bias current, 1 pA typ
Low input offset voltage: 1.5 mV max
(A grade)
ESD internal protection ≥ 5 kV
Latch-up immunity
Applications
Battery-powered applications
Portable devices
Signal conditioning
Active filtering
Medical instrumentation
Automotive applications
Related products
See TSV99x, TSV99xA for higher gain
bandwidth (not unity gain stable)
Description
The TSV91x operational amplifiers (op amps)
offer low voltage operation and rail-to-rail input
and output, as well as an excellent speed/power
consumption ratio, providing an 8 MHz gain-
bandwidth product while consuming only 1.1 mA
maximum at 5 V. The op amps are unity gain
stable and feature an ultra-low input bias current.
The devices are ideal for sensor interfaces,
battery-supplied and portable applications, as
well as active filtering.
Table 1: Device summary
Reference
Single
Dual
Quad
TSV91x
TSV91xA (1)
TSV911
TSV911A
TSV912
TSV912A
TSV914
TSV914A
Notes:
(1)Suffix "A" refers to enhanced Vio performance
August 2016
DocID12584 Rev 10
This is information on a product in full production.
1/27
www.st.com



STMicroelectronics TSV911A
Contents
TSV91x, TSV91xA
Contents
1 Package pin connections................................................................ 3
2 Absolute maximum ratings and operating conditions ................. 4
3 Electrical characteristics ................................................................ 6
4 Electrical characteristic curves .................................................... 12
5 Application information ................................................................ 15
5.1 Driving resistive and capacitive loads ............................................. 15
5.2 PCB layouts .................................................................................... 15
5.3 Macromodel .................................................................................... 15
6 Package information ..................................................................... 16
6.1 SOT23-5 package information ........................................................ 17
6.2 DFN8 2 x 2 package information..................................................... 18
6.3 MiniSO8 package information ......................................................... 20
6.4 SO8 package information................................................................ 21
6.5 TSSOP14 package information....................................................... 22
6.6 SO14 package information.............................................................. 23
7 Ordering information..................................................................... 24
8 Revision history ............................................................................ 25
2/27 DocID12584 Rev 10



STMicroelectronics TSV911A
TSV91x, TSV91xA
Package pin connections
1 Package pin connections
Figure 1: Pin connections for each package (top view)
1. The exposed pad of the DFN8 2x2 package is not internally connected and can be set to ground or left
floating.
DocID12584 Rev 10
3/27







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