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FQPF16N25C Dataheets PDF



Part Number FQPF16N25C
Manufacturers Fairchild Semiconductor
Logo Fairchild Semiconductor
Description N-Channel QFET MOSFET
Datasheet FQPF16N25C DatasheetFQPF16N25C Datasheet (PDF)

FQPF16N25C — N-Channel QFET® MOSFET FQPF16N25C N-Channel QFET® MOSFET 250 V, 15.6 A, 270 mΩ Features • 15.6 A, 250 V, RDS(on) = 270 mΩ (Max) @ VGS = 10 V, ID = 7.8 A • Low Gate Charge (Typ. 41 nC) • Low Crss (Typ. 68 pF) • 100% Avalanche Tested November 2013 Description This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance,.

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FQPF16N25C — N-Channel QFET® MOSFET FQPF16N25C N-Channel QFET® MOSFET 250 V, 15.6 A, 270 mΩ Features • 15.6 A, 250 V, RDS(on) = 270 mΩ (Max) @ VGS = 10 V, ID = 7.8 A • Low Gate Charge (Typ. 41 nC) • Low Crss (Typ. 68 pF) • 100% Avalanche Tested November 2013 Description This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. D GDS TO-220F G MOSFET Maximum Ratings TC = 25oC unless otherwise noted. Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Parameter Drain to Source Voltage Drain Current Drain Current - Continuous (TC = 25oC) - Continuous (TC = 100oC) - Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25oC) - Derate Above 25oC Operating and Storage Temperature Range Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds (Note 1) (Note 2) (Note 1) (Note 1) (Note 3) *Drain current limited by maximum junction temperature Thermal Characteristics Symbol RθJC RθJA Parameter Thermal Resistance, Junction to Case, Max Thermal Resistance, Junction to Ambient, Max S FQPF16N25C 250 15.6 * 9.8 * 62.4 * ± 30 410 15.6 13.9 5.5 43 0.34 -55 to +150 300 FQPF16N25C 2.89 62.5 Unit V A A A V mJ A mJ V/ns W W/°C °C °C Unit °C/W °C/W ©2004 Fairchild Semiconductor Corporation FQPF16N25C Rev. C1 1 www.fairchildsemi.com FQPF16N25C — N-Channel QFET® MOSFET Package Marking and Ordering Information Device Marking FQPF16N25C Device FQPF16N25C Package TO-220F Electrical Characteristics TC = 25oC unless otherwise noted. Symbol Parameter Test Conditions Reel Size Tube Tape Width N/A Quantity 50 units Min. Typ. Max. Unit Off Characteristics BVDSS Drain-Source Breakdown Voltage ΔBVDSS Breakdown Voltage Temperature Coeffi/ ΔTJ cient IDSS Zero Gate Voltage Drain Current IGSSF IGSSR Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS = 0 V, ID = 250 μA ID = 250 μA, Referenced to 25°C VDS = 250 V, VGS = 0 V VDS = 200 V, TC = 125°C VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V On Characteristics VGS(th) RDS(on) Gate Threshold Voltage Static Drain-Source On-Resistance gFS Forward Transconductance VDS = VGS, ID = 250 μA VGS = 10 V, ID = 7.8 A VDS = 40 V, ID = 7.8 A Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 125 V, I.


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