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Z0K121-RB-10 Dataheets PDF



Part Number Z0K121-RB-10
Manufacturers Superworld Electronics
Logo Superworld Electronics
Description FERRITE CHIP BEADS
Datasheet Z0K121-RB-10 DatasheetZ0K121-RB-10 Datasheet (PDF)

FERRITE CHIP BEADS Z0 SERIES 1. PART NO. EXPRESSION : Z0K121-RB-10 (a)(b)(c) (d) (e)(f) (g) (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 470 = 47ȍ 2. CONFIGURATION & DIMENSIONS : A D (e) R : Reel (f) Current : C = 300mA (g) : 10 : RoHS Compliant 11 ~ 99 : Internal controlled number C B Unit:m/m ABCD 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05 3. SCHEMATIC : 4. MATERIALS : ba Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination :.

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FERRITE CHIP BEADS Z0 SERIES 1. PART NO. EXPRESSION : Z0K121-RB-10 (a)(b)(c) (d) (e)(f) (g) (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 470 = 47ȍ 2. CONFIGURATION & DIMENSIONS : A D (e) R : Reel (f) Current : C = 300mA (g) : 10 : RoHS Compliant 11 ~ 99 : Internal controlled number C B Unit:m/m ABCD 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05 3. SCHEMATIC : 4. MATERIALS : ba Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C ( include self-temp. rise ) e) Resistance to solder heat : 260°C.10secs www.DataSheet4U.com NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE 11.08.2010 LTD PG. 1 FERRITE CHIP BEADS Z0 SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Z0K121-RBZ0K181-RAZ0M100-REZ0M220-RCZ0M300-RCZ0M470-RBZ0M600-RA- Impedance (ȍ) 120 ± 25% 180 ± 25% 10 ± 25% 22 ± 25% 30 ± 25% 47 ± 25% 60 ± 25% Test Frequency ( Hz ) 100M 100M 100M 100M 100M 100M 100M DC Resistance (ȍ) Max. 0.50 0.70 0.15 0.20 0.25 0.30 0.30 Rated Current ( mA ) Max. 200 100 500 300 300 200 100 7. IMPEDANCE VS. FREQUENCY CURVES : FCMZ00K61012321K1--RFRB-B1-…2-11…0T02 40 0 30 0 IMPEDANCE(O hm) 20 0 10 0 0 1 50 40 30 20 10 0 1 Z R 1 0 100 FREQ UENC Y(M Hz) X FCZMZ00M0M61001030-M0R-EFR--E…1-01…0 T05 Z R 10 100 F REQ U EN CY(M Hz) IMPEDANCE (O hm) 10 00 X 1 00 0 IMPE DAN CE (O hm ) IMPEDANCE(Ohm ) 500 400 300 200 100 0 1 120 80 40 0 1 FCMZZ000KK610183811K-R-FRA-A1-…8-11…0T0 1 Z R 10 10 0 FREQ UENC Y(M H z) FC MZZ000M6M022322M00-F-RR-C2C2--1…00T…0 3 X 100 0 Z X R 10 100 F REQU ENCY(MHz) 100 0 www.DataSheet4U.com NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE 11.08.2010 LTD PG. 2 FERRITE CHIP BEADS 7. IMPEDANCE VS. FREQUENCY CURVES : FCMZ000M6M0333000M0-RF-RC-3C-…0-10…0T03 180 IMPEDANCE(O hm) 120 60 0 1 300 Z R 10 100 F REQUE NCY(M H z) X 100 0 FCMZZ00M66060300M0--RFRA-A-6…-01…00T01 IM PEDANCE(O hm ) 200 100 0 1 Z X R 10 100 F REQU ENCY(M Hz) 100 0 IMPEDANCE (O hm) 30 0 20 0 10 0 0 1 Z0 SERIES F CMZ0Z06M0 0M4374M07-R0F--BR4-B7…0-…1T00 2 Z X R 1 0 100 FREQ UENCY( MHz) 1 00 0 www.DataSheet4U.com NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE 11.08.2010 LTD PG. 3 FERRITE CHIP BEADS Z0 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Refer to standard electrical characteristics list 30°C max. (ǻt) Solder Heat Resistance Solderability Terminal Strength Appearance : No significant abnormality Impedance change : Within ±30% Preheating Dipping Natural 260°C cooling 150°C 60 seconds 10±0.5 seconds More than 90% of the terminal electrode should be covered with solder. Preheating Dipping Natural 245°C cooling 150°C 60 seconds 4±1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W TEST CONDITION HP4291A, HP4287A+16092A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. For Z Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 8 2.0 Time (sec) > 25 Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 45(1.772) 45(1.772) Bending 40(1.575) 100(3.937) www.DataSheet4U.com NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE 11.08.2010 LTD PG. 4 FERRITE CHIP BEADS Z0 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE Bending Strength The ferrite should not be damaged by forces applied on the right condition. R0.5(0.02) 1.0(0.039) Chip A Random Vibration Test Loading at High Temperature Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance : Within ±30% Appearance : No damage. Impedance : Within ±30% of initial value. Humidity Thermal Shock Low temperature storage test Appearance : No damage. Impedance : Within ±30% of initial value. Phase 1 2 Temperature (°C) -55±2°C +125±5°C Measured : 5 times Times (min.) 30±3 30±3 Drop a. No mechanical damage b. Impedance .


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