Document
LEDTECH ELECTRONICS CORP.
NANYA ROAD,MUGANG ZHAOQING CITY GUANGDONG CHINA.
TEL:86-758-2875541,2870651,2877464,2876185,2877017 FAX:86-758-2878014
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LB5021-11 NWRN 0.5"(12.7mm)SQUARE LIGHT BAR
Approved by
Tung
Checked by
Andy
Prepared by
Zhou
LB5021-11
Dimensions
6.35
12.7
64 AB 13
8.0 7.49
0.5" SQUARE LIGHT BAR
0.5 DIA.
5.08
13.97
MARK
AB
3.5 MIN.
Chip Position
2.54X2=5.08
Notes:
1. The slope angle of any PIN may be ±5.0° Max. 2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted.
Internal Circuit Diagram
LB5021-11
PIN. 1
A
4
B
PIN. 6
3
PIN 2 :NO PIN PIN 5 :NO CONNECTION
VER.: 01 Date: 2007/01/23 Page: 1/5
Description
Part No.
LB5021-11 NWRN
LB5021-11
0.5" SQUARE LIGHT BAR
LED Chip
Material
Emitting Color
Face Color
Surface Segments
GaP/GaP
Green
Water
White
Absolute Maximum Ratings at Ta=25
Parameter
Symbol
Rating
Unit
Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range
Soldering Temperature.
PD IFP IF Ir VR Topr. Tstg. Tsol.
156 mW
100 mA
30 mA 100 uA 5V -25 to +85 -40 to +100 Dip Soldering: 260 for 5 sec. Hand Soldering: 350 for 3 sec.
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LB5021-11
0.5" SQUARE LIGHT BAR
Electrical and Optical Characteristics:
Parameter
Symbol Condition Min. Typ. Max. Unit
Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time
IV
If=10mA
1.7 3.5
mcd
Vf If=20mA
2.1 2.6
V
λp If=20mA
567 nm
λd If=20mA
572 nm
Ir Vr=5V
100 µA
∆λ If=20mA
30 nm
T -----------
250 ns
Note: Customer’s special requirements are also welcome.
VER.: 01 Date: 2007/01/23 Page: 3/5
LB5021-11
0.5" SQUARE LIGHT BAR
Typical Electrical/Optical Characteristic Curves (25 Ambient Temperature Unless Otherwise Noted)
1.0 100 OPERATION IN THIS
REGION REQUIRES TEMPERATURE DERATING OF IDC MAXIMUM
0.5 10
Ratio of Maximum Operating Peak Current to Temperature Derated DC Current
Relative Intensity
IF PEAK IDC MAX
100HZ 300HZ
1KHZ
3KHZ 10KHZ
Forward Current IF(mA)
510 570
630
Wavelength (nm)
Fig.1 RELATIVE INTENSITY VS. WAVELENGTH
690
50 40
30
20
10
1.7 1.9 2.1 2.3 2.5 2.7 Forward Voltage VF(V)
Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP
5
4
3
2
1
0 10 20 30 40 Forward Current (mA)
Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT
Relative Luminous Intensity
Forward Current IF(mA)
1 1 10 100 1000 10000 tp - Pulse Duration - s
Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION
50 40
30 20 10
0 20 40 60 80 100
Ambient Temperature Ta (°C) Fig.4 FORWARD CURRENT VS.
DERATING CURVE
2.0 1.0 0.5 0.2 0.1-30 -20 -10 0 10 20 30 40 50 60 70
Ambient Temperature Ta (°C) Fig.6 LUMINOUS INTENSITY VS.
AMBIENT TEMPERATURE
Relative Luminous Intensity Normalized at 10mA
VER.: 01 Date: 2007/01/23 Page: 4/5
LB5021-11
0.5" SQUARE LIGHT BAR
Precautions in Use:
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be ∘ repeated no more than two times.
2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc.
3. The hole pitch of a circuit board must fit into the lead pitch of products.
4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90 Max. for within 60 Sec. Soldering Max. : 260 5 (Solder Temp.) for within 5 Sec. (b) Soldering iron : 350
Max. Cleaning time : 30Sec. Max. 6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent
onto the product surface or to LED chips, or invasion of the same into the product.
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