DatasheetsPDF.com

LB5021-11 Dataheets PDF



Part Number LB5021-11
Manufacturers Ledtech
Logo Ledtech
Description SQUARE LIGHT BAR
Datasheet LB5021-11 DatasheetLB5021-11 Datasheet (PDF)

LEDTECH ELECTRONICS CORP. NANYA ROAD,MUGANG ZHAOQING CITY GUANGDONG CHINA. TEL:86-758-2875541,2870651,2877464,2876185,2877017 FAX:86-758-2878014 Http://www.ledtech.com.tw SPECIFICATION PART NO. : LB5021-11 NWRN 0.5"(12.7mm)SQUARE LIGHT BAR Approved by Tung Checked by Andy Prepared by Zhou LB5021-11 Dimensions 6.35 12.7 64 AB 13 8.0 7.49 0.5" SQUARE LIGHT BAR 0.5 DIA. 5.08 13.97 MARK AB 3.5 MIN. Chip Position 2.54X2=5.08 Notes: 1. The slope angle of any PIN may be ±5.0° Max. 2. Al.

  LB5021-11   LB5021-11


Document
LEDTECH ELECTRONICS CORP. NANYA ROAD,MUGANG ZHAOQING CITY GUANGDONG CHINA. TEL:86-758-2875541,2870651,2877464,2876185,2877017 FAX:86-758-2878014 Http://www.ledtech.com.tw SPECIFICATION PART NO. : LB5021-11 NWRN 0.5"(12.7mm)SQUARE LIGHT BAR Approved by Tung Checked by Andy Prepared by Zhou LB5021-11 Dimensions 6.35 12.7 64 AB 13 8.0 7.49 0.5" SQUARE LIGHT BAR 0.5 DIA. 5.08 13.97 MARK AB 3.5 MIN. Chip Position 2.54X2=5.08 Notes: 1. The slope angle of any PIN may be ±5.0° Max. 2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted. Internal Circuit Diagram LB5021-11 PIN. 1 A 4 B PIN. 6 3 PIN 2 :NO PIN PIN 5 :NO CONNECTION VER.: 01 Date: 2007/01/23 Page: 1/5 Description Part No. LB5021-11 NWRN LB5021-11 0.5" SQUARE LIGHT BAR LED Chip Material Emitting Color Face Color Surface Segments GaP/GaP Green Water White Absolute Maximum Ratings at Ta=25 Parameter Symbol Rating Unit Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature. PD IFP IF Ir VR Topr. Tstg. Tsol. 156 mW 100 mA 30 mA 100 uA 5V -25 to +85 -40 to +100 Dip Soldering: 260 for 5 sec. Hand Soldering: 350 for 3 sec. VER.: 01 Date: 2007/01/23 Page: 2/5 LB5021-11 0.5" SQUARE LIGHT BAR Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time IV If=10mA 1.7 3.5 mcd Vf If=20mA 2.1 2.6 V λp If=20mA 567 nm λd If=20mA 572 nm Ir Vr=5V 100 µA ∆λ If=20mA 30 nm T ----------- 250 ns Note: Customer’s special requirements are also welcome. VER.: 01 Date: 2007/01/23 Page: 3/5 LB5021-11 0.5" SQUARE LIGHT BAR Typical Electrical/Optical Characteristic Curves (25 Ambient Temperature Unless Otherwise Noted) 1.0 100 OPERATION IN THIS REGION REQUIRES TEMPERATURE DERATING OF IDC MAXIMUM 0.5 10 Ratio of Maximum Operating Peak Current to Temperature Derated DC Current Relative Intensity IF PEAK IDC MAX 100HZ 300HZ 1KHZ 3KHZ 10KHZ Forward Current IF(mA) 510 570 630 Wavelength (nm) Fig.1 RELATIVE INTENSITY VS. WAVELENGTH 690 50 40 30 20 10 1.7 1.9 2.1 2.3 2.5 2.7 Forward Voltage VF(V) Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP 5 4 3 2 1 0 10 20 30 40 Forward Current (mA) Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Relative Luminous Intensity Forward Current IF(mA) 1 1 10 100 1000 10000 tp - Pulse Duration - s Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION 50 40 30 20 10 0 20 40 60 80 100 Ambient Temperature Ta (°C) Fig.4 FORWARD CURRENT VS. DERATING CURVE 2.0 1.0 0.5 0.2 0.1-30 -20 -10 0 10 20 30 40 50 60 70 Ambient Temperature Ta (°C) Fig.6 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE Relative Luminous Intensity Normalized at 10mA VER.: 01 Date: 2007/01/23 Page: 4/5 LB5021-11 0.5" SQUARE LIGHT BAR Precautions in Use: PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY 1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be ∘ repeated no more than two times. 2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90 Max. for within 60 Sec. Soldering Max. : 260 5 (Solder Temp.) for within 5 Sec. (b) Soldering iron : 350 Max. Cleaning time : 30Sec. Max. 6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product. VER.: 01 Date: 2007/01/23 Page: 5/5 .


LM5623-11EWRN LB5021-11 LB5021-11NWRN


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)