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R5F101SKAFB Dataheets PDF



Part Number R5F101SKAFB
Manufacturers Renesas
Logo Renesas
Description 16-Bit Single-Chip Microcontrollers
Datasheet R5F101SKAFB DatasheetR5F101SKAFB Datasheet (PDF)

Datasheet RL78/G13 RENESAS MCU R01DS0131EJ0350 Rev.3.50 Jun 30, 2020 True low-power platform (66 μA/MHz, and 0.57 μA for operation with only RTC and LVD) for the general-purpose applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz 1. OUTLINE 1.1 Features Ultra-low power consumption technology  VDD = single power supply voltage of 1.6 to 5.5 V  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  M.

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Datasheet RL78/G13 RENESAS MCU R01DS0131EJ0350 Rev.3.50 Jun 30, 2020 True low-power platform (66 μA/MHz, and 0.57 μA for operation with only RTC and LVD) for the general-purpose applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz 1. OUTLINE 1.1 Features Ultra-low power consumption technology  VDD = single power supply voltage of 1.6 to 5.5 V  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  Minimum instruction execution time: Can be changed from high speed (0.03125 μs: @ 32 MHz operation with high-speed on-chip oscillator) to ultra-low speed (30.5 μs: @ 32.768 kHz operation with subsystem clock)  Address space: 1 MB  General-purpose registers: (8-bit register × 8) × 4 banks  On-chip RAM: 2 to 32 KB Code flash memory  Code flash memory: 16 to 512 KB  Block size: 1 KB  Prohibition of block erase and rewriting (security function)  On-chip debug function  Self-programming (with boot swap function/flash shield window function) Data Flash Memory  Data flash memory: 4 KB to 8 KB  Back ground operation (BGO): Instructions can be executed from the program memory while rewriting the data flash memory.  Number of rewrites: 1,000,000 times (TYP.)  Voltage of rewrites: VDD = 1.8 to 5.5 V High-speed on-chip oscillator  Select from 32 MHz, 24 MHz, 16 MHz, 12 MHz, 8 MHz, 6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz  High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20 to +85°C) Operating ambient temperature  TA = -40 to +85°C (A: Consumer applications, D: Industrial applications )  TA = -40 to +105°C (G: Industrial applications) Power management and reset function  On-chip power-on-reset (POR) circuit  On-chip voltage detector (LVD) (Select interrupt and reset from 14 levels) DMA (Direct Memory Access) controller  2/4 channels  Number of clocks during transfer between 8/16-bit SFR and internal RAM: 2 clocks Multiplier and divider/multiply-accumulator  16 bits × 16 bits = 32 bits (Unsigned or signed)  32 bits ÷ 32 bits = 32 bits (Unsigned)  16 bits × 16 bits + 32 bits = 32 bits (Unsigned or signed) Serial interface  CSI: 2 to 8 channels  UART/UART (LIN-bus supported): 2 to 4 channels  I2C/Simplified I2C communication: 3 to 10 channels Timer  16-bit timer: 8 to 16 channels  12-bit interval timer: 1 channel  Real-time clock: 1 channel (calendar for 99 years, alarm function, and clock correction function)  Watchdog timer: 1 channel (operable with the dedicated low-speed on-chip oscillator) A/D converter  8/10-bit resolution A/D converter (VDD = 1.6 to 5.5 V)  Analog input: 6 to 26 channels  Internal reference voltage (1.45 V) and temperature sensor Note 1 I/O port  I/O port: 16 to 120 (N-ch open drain I/O [withstand voltage of 6 V]: 0 to 4, N-ch open drain I/O [VDD withstand voltage Note 2/EVDD withstand voltage Note 3]: 5 to 25)  Can be set to N-ch open drain, TTL input buffer, and on-chip pull-up resistor  Diffe.


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