AGN20009

GNTESTING ULTRA-SMALL PACKAGE GN-RELAYSSLIM POLARIZED RELAY 10.60±0.3 .417±.012 5.70±0.3 .224±.012 9.00±0.3 .354±.012 10.60±0.3 .417±.012 5.70±0.3 .224±.012 Max.10.00 .394 mm inch FEATURES Compact slim body saves space Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs. Outstanding surge resistance. Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore) The use of twin crossbar contacts ensures high contact reliability. AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil. Increased packaging density Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before. Nominal operating power: 140 mW Outstanding vibration and shock resistance. Functional shock resistance: 750 m/s2 {75G} Destructive shock resistance: 1,000 m/s2 {100G} Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch) Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch) SPECIFICATIONS Contact Arrangement 2 Form C Initial conta...