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AS5510 Dataheets PDF



Part Number AS5510
Manufacturers ams
Logo ams
Description Linear Hall Sensor
Datasheet AS5510 DatasheetAS5510 Datasheet (PDF)

General Description Figure 1: Added Value of Using AS5510 Benefits Highest reliability and durability Ideal for battery powered devices Easy to use High-resolution output Operates in wide magnetic range Smallest form factor AS5510 Linear Hall Sensor with I²C Output The AS5510 is a Linear Hall Sensor with 10 bit resolution and I²C interface. It can measure absolute position of lateral movement of a simple 2-pole magnet. Depending on the magnet size, a lateral stroke of 0.5~2mm can be measured wi.

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General Description Figure 1: Added Value of Using AS5510 Benefits Highest reliability and durability Ideal for battery powered devices Easy to use High-resolution output Operates in wide magnetic range Smallest form factor AS5510 Linear Hall Sensor with I²C Output The AS5510 is a Linear Hall Sensor with 10 bit resolution and I²C interface. It can measure absolute position of lateral movement of a simple 2-pole magnet. Depending on the magnet size, a lateral stroke of 0.5~2mm can be measured with air gaps around 1.0mm. To conserve power, the AS5510 may be switched to a power down state when it is not used. It is available in a WLCSP and SOIC8 package and qualified for an ambient temperature range from -30°C to 85°C. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of AS5510, Linear Hall sensor with I²C output are listed below: Features Contactless position measurement Power down mode Simple configuration over the I2C interface 10bit resolution Programmable sensitivity Available in two different packages: WLCSP & SOIC8 Applications The AS5510 is ideal for: • Position sensing • Servo drive feedback • Camera lens control • Closed loop position control. ams Datasheet [v1-07] 2015-Feb-27 Page 1 Document Feedback Figure 2: AS5510 Block Diagram AS5510− GeneralDescription Block Diagram The functional blocks of this device for reference are shown below: Front End Offset Compensation Buffer & Filter ADC 10 bit Power down Biasing & Reference Factory Gain Trim DSP I2C Test SDA SCL ADR VDD VSS Page 2 Document Feedback ams Datasheet [v1-07] 2015-Feb-27 AS5510 − Pin Assignment Pin Assignment Pin Configuration of AS5510 in WLCSP Package(Top view): The AS5510 is available in a 6-pin Chip Scale Package with a ball pitch of 400μm. The AS5510 pin assignments are described below. Figure 3: Pin Diagram for WLCSP Package Pin A1 indicator 1 23 A VSS ADR VDD B SDA SCL Test Pin Configuration of AS5510 in SOIC8 Package(Top view): Package drawing not to scale. Figure 4: Pin Diagram for SOIC8 Package NC 1 VSS 2 ADR 3 VDD 4 AS5510 8 NC 7 SCL 6 SDA 5 TEST ams Datasheet [v1-07] 2015-Feb-27 Page 3 Document Feedback AS5510 − PinAssignment Figure 5: Pin Description Pin Name Pin Number WLCSP SOIC8 Pin Type Description NC - 1 - Not Connected VSS A1 2 Supply pin Negative supply pin, analog and digital ground ADR A2 3 Digital input I²C address selection pin Connect to either VSS (56h) or VDD (57h) VDD A3 4 Supply pin Positive supply pin. A capacitor of 100nF should be connected to this pin and VSS Test B3 5 Digital input/output Test pin, must be connected to VSS during operation SDA B1 6 Digital input / Digital output open drain I²C data I/O, 20mA driving capability SCL B2 7 Digital input I²C clock NC - 8 - Not Connected Page 4 Document Feedback ams Datasheet [v1-07] 2015-Feb-27 AS5510 − Absolute Maximum Ratings Absolute Maximum Ratings Figure 6: Absolute Maximum Ratings Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Min Max Units Comments DC supply voltage at pin VDD -0.3 5 V Input pin voltage -0.3 VDD+0.3 V Input current (latchup immunity) -100 100 mA Norm: JEDEC 78 Electrostatic discharge ±2 kV Norm: MIL 883 E method 3015 Storage temperature -55 125 °C Body temperature (Lead-free package) for WLCSP Body temperature (Lead-free package) for SOIC8 TBody 260 260 The reflow peak soldering temperature (body temperature) specified is in °C accordance with IPC/ JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. Relative Humidity non-condensing 5 85 % Moisture Sensitivity Level for WLCSP Moisture Sensitivity Level for SOIC8 1 3 Represents a max. floor life time of unlimited ams Datasheet [v1-07] 2015-Feb-27 Page 5 Document Feedback AS5510− ElectricalCharacteristics Electrical Characteristics Figure 7: Operating Conditions Symbol Parameter VDD Supply voltage at pin VDD Isupp Ipd Tamb Supply current Power down current Ambient temperature Conditions Min Typ Max Units 2.5 3 3.6 V @ 25°C ambient temperature 3.5 25 mA μA -30 85 °C Figure 8: Electrical Characteristics ADR Input DC Characteristics for Digital Inputs and Outputs CMOS Input: ADR Operating conditions: Tamb = -30°C to 85°C, VDD = 2.5V to 3.6V (3V operation) unless otherwise noted. Symbol VIH VIL ILEAK Parameter High level input voltage Low level input voltage Input leakage current Min Typ Max 0.7 * VDD VDD 0 0.3 * VDD -1 1 Units V V μA Page 6 Document Feedback ams Datashe.


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