EMIPAK-1B PressFit Power-Module
www.vishay.com
VS-ENQ030L120S
Vishay Semiconductors
EMIPAK-1B PressFit Power Module Neutral Point Clamp Topology, 30 A...
Description
www.vishay.com
VS-ENQ030L120S
Vishay Semiconductors
EMIPAK-1B PressFit Power Module Neutral Point Clamp Topology, 30 A
EMIPAK-1B (package example)
FEATURES Ultrafast Trench IGBT technology HEXFRED® and silicon carbide diode technology PressFit pins technology Exposed Al2O3 substrate with low thermal resistance Low internal inductances PressFit pins locking technology. Patent # US.263.820 B2 UL approved file E78996 Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
TRENCH IGBT 1200 V STAGE
VCES VCE(ON) typical at IC = 30 A
1200 V 2.12 V
IC at TC = 102 °C
30 A
TRENCH IGBT 600 V STAGE
VCES VCE(ON) typical at IC = 30 A
600 V 1.42 V
IC at TC = 106 °C Speed
30 A 8 kHz to 30 kHz
Package
EMIPAK-1B
Circuit
3-levels neutral point clamp topology
DESCRIPTION
VS-ENQ030L120S is an integrated solution for a neutral point clamp topology in a single package. The EMIPAK-1B package is easy to use thanks to the PressFit pins and the exposed substrate provides improved thermal performance. The optimized layout also helps to minimize stray parameters, allowing for better EMI performance.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
Operating junction temperature Storage temperature range RMS isolation voltage Q1 - Q4 TRENCH IGBT 1200 V
TJ TStg VISOL
TJ = 25 °C, all terminals shorted, f = 50 Hz, t = 1 s
Collector to emitter voltage
VCES
Gate to emitter voltage
VGES
P...
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