HC1000

Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section E Features and Benefits Thermal conductivity: 1.0 W/m-K Highly conformable, low hardness “Gel-like” modulus Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material. Note: Resultant thickness is defined as the final gap thickness of the application. 20 18 16 14 12 10 0.25 Thickness vs. Thermal Resistance Gap Pad HC1000 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in2/W) 0.55 PROPERTY Color TYPICAL PROPERTIES OF GAP PAD HC1000 IMPERIAL VALUE METRIC VALUE TEST METHOD Gray Gray Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.015 to 0.020 0.381 to 0.508 ASTM D374 Inherent Surface Tack (1- or 2-sided) 2 2— Density (g/cc) 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 25 25 ASTM D2240 Young’s Modulus (psi) / (kPa) (2) 40 275 ASTM D575 Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 — ELECTRICAL Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D14...