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TMP87C814FG Dataheets PDF



Part Number TMP87C814FG
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description CMOS 8-Bit Microcontroller
Datasheet TMP87C814FG DatasheetTMP87C814FG Datasheet (PDF)

TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870 Series TMP87C814NG, TMP87C814FG TMP87CH14NG, TMP87CH14FG TMP87CK14NG, TMP87CK14FG TMP87CM14NG, TMP87CM14FG Semiconductor Company TMP87C814/H14/K14/M14 Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revis.

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TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870 Series TMP87C814NG, TMP87C814FG TMP87CH14NG, TMP87CH14FG TMP87CK14NG, TMP87CK14FG TMP87CM14NG, TMP87CM14FG Semiconductor Company TMP87C814/H14/K14/M14 Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. 1. Part number Example: TMPxxxxxxF TMPxxxxxxFG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. I 2008-03-06 TMP87C814/H14/K14/M14 1. Part number 2. Package code and dimensions Previous Part Number Previous Package Code (in Body Text) (in Body Text) New Part Number New Package Code OTP TMP87C814N SDIP64-P-750-1.78 TMP87C814NG SDIP64-P-750-1.78 TMP87PM14NG TMP87C814F QFP64-P-1420-1.00A TMP87C814FG QFP64-P-1420-1.00A TMP87PM14FG TMP87CH14N SDIP64-P-750-1.78 TMP87CH14NG SDIP64-P-750-1.78 TMP87PM14NG TMP87CH14F QFP64-P-1420-1.00A TMP87CH14FG QFP64-P-1420-1.00A TMP87PM14FG TMP87CK14N SDIP64-P-750-1.78 TMP87CK14NG SDIP64-P-750-1.78 TMP87PM14NG TMP87CK14F QFP64-P-1420-1.00A TMP87CK14FG QFP64-P-1420-1.00A TMP87PM14FG TMP87CM14N SDIP64-P-750-1.78 TMP87CM14NG SDIP64-P-750-1.78 TMP87PM14NG TMP87CM14F QFP64-P-1420-1.00A TMP87CM14FG QFP64-P-1420-1.00A TMP87PM14FG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Solderability Test Conditions (1) Use of Lead (Pb) ·solder bath temperature = 230°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux (2) Use of Lead (Pb)-Free ·solder bath temperature = 245°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux Remark Leads with over 95% solder coverage till lead forming are acceptable. II 2008-03-06 TMP87C814/H14/K14/M14 4. RESTRICTIONS .


TMP87C814NG TMP87C814FG TMP87CH14NG


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