Document
TOSHIBA Original CMOS 8-Bit Microcontroller
TLCS-870 Series
TMP87C814NG, TMP87C814FG TMP87CH14NG, TMP87CH14FG TMP87CK14NG, TMP87CK14FG TMP87CM14NG, TMP87CM14FG
Semiconductor Company
TMP87C814/H14/K14/M14
Document Change Notification
The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revision of the datasheet.
Changes to the datasheet may include the following, though not all of them may apply to this particular device.
1. Part number Example: TMPxxxxxxF TMPxxxxxxFG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification).
2. Package code and package dimensions Example: LQFP100-P-1414-0.50C LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages.
3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added.
4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page.
5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device.
I 2008-03-06
TMP87C814/H14/K14/M14
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
(in Body Text)
(in Body Text)
New Part Number
New Package Code
OTP
TMP87C814N
SDIP64-P-750-1.78
TMP87C814NG
SDIP64-P-750-1.78
TMP87PM14NG
TMP87C814F
QFP64-P-1420-1.00A
TMP87C814FG
QFP64-P-1420-1.00A TMP87PM14FG
TMP87CH14N
SDIP64-P-750-1.78
TMP87CH14NG
SDIP64-P-750-1.78
TMP87PM14NG
TMP87CH14F
QFP64-P-1420-1.00A
TMP87CH14FG
QFP64-P-1420-1.00A TMP87PM14FG
TMP87CK14N
SDIP64-P-750-1.78
TMP87CK14NG
SDIP64-P-750-1.78
TMP87PM14NG
TMP87CK14F
QFP64-P-1420-1.00A
TMP87CK14FG
QFP64-P-1420-1.00A TMP87PM14FG
TMP87CM14N
SDIP64-P-750-1.78
TMP87CM14NG
SDIP64-P-750-1.78
TMP87PM14NG
TMP87CM14F
QFP64-P-1420-1.00A
TMP87CM14FG
QFP64-P-1420-1.00A TMP87PM14FG
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Solderability
Test Conditions
(1) Use of Lead (Pb) ·solder bath temperature = 230°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux
(2) Use of Lead (Pb)-Free ·solder bath temperature = 245°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux
Remark
Leads with over 95% solder coverage till lead forming are acceptable.
II 2008-03-06
TMP87C814/H14/K14/M14
4. RESTRICTIONS .