Power MOSFET
NTD4856N, NVD4856N
Power MOSFET
25 V, 89 A, Single N−Channel, DPAK/IPAK
Features
• Trench Technology • Low RDS(on) to ...
Description
NTD4856N, NVD4856N
Power MOSFET
25 V, 89 A, Single N−Channel, DPAK/IPAK
Features
Trench Technology Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Applications
VCORE Applications DC−DC Converters Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current RqJA (Note 1)
VDSS
25
V
VGS
±20
V
TA = 25°C
ID
16.8
A
TA = 85°C
13.0
Power Dissipation RqJA (Note 1)
TA = 25°C
PD
2.14
W
Continuous Drain
TA = 25°C
ID
Current RqJA (Note 2)
Steady TA = 85°C
Power Dissipation
State
TA = 25°C
PD
RqJA (Note 2)
13.3
A
10.3
1.33
W
Continuous Drain Current RqJC (Note 1)
TC = 25°C
ID
TC = 85°C
89
A
69
Power Dissipation RqJC (Note 1)
TC = 25°C
PD
60
W
Pulsed Drain Current
tp=10ms TA = 25°C
IDM
179
A
Current Limited by Package
TA = 25°C
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
IDmaxPkg TJ, TSTG IS
dV/dt
45 −55 to +175
50 6
A °C
A V/ns
Single Pulse Drain−to−Source Avalanche Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V, IL = 19 Apk, L = 1.0 mH, RG = 25 W)
Lead Temperature for Soldering Purposes...
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