Document
5mm Infrared LED,T-1 3/4 IR333C/H0/L10
Features
․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version.
Description
․EVERLIGHT’s Infrared Emitting Diode (IR333C/H0/L10) is a
high intensity diode , molded in a water clear plastic package.
․The device is spectrally matched with phototransistor , photodiode and infrared receiver module.
Applications
․Infrared applied system
Revi1sion Copy:rig5ht © 2010, Everlight All Rights Reserved. Release Date : MAY.23.2013. Issue RNoe: lDeIRa-s0e00D07a21te:2013-05-2w7w1w4.:e3v9e:r4li5g.h0t.com
LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10
Device Selection Guide
Chip Materials GaAlAs
Lens Color Water clear
Absolute Maximum Ratings (Ta=25 )
Parameter
Continuous Forward Current Peak Forward Current(*1) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature(*2) Power Dissipation at (or below) 25 Free Air Temperature
Symbol
IF IFP VR Topr Tstg Tsol
Pd
Rating
100 1.0 5 -40 ~ +85 -40 ~ +100 260
150
Notes: *1:IFP Conditions--Pulse Width 100μs and Duty 1%. *2:Soldering time 5 seconds.
Unit mA A V
mW
Revi2sion Copy:rig5ht © 2010, Everlight All Rights Reserved. Release Date :MAY.23.2013. Issue NRo:eDleIRa-0s0e00D72a1te:2013-05-2w7w1w4.:e3v9e:r4li5g.h0t.com
LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10
Electro-Optical Characteristics (Ta=25 )
Parameter Radiant Intensity Peak Wavelength Spectral Bandwidth Forward Voltage Reverse Current View Angle
Symbol Min. Typ. Max. Unit Ie 7.8 10 ----- mW/sr
----- 45 ----λp ----- 940 ----- nm
Condition
IF=20mA IF=100mA
IF=20mA
Δλ
VF IR 2θ1/2
----- 45 ----- nm
----- 1.2 ----- 1.4 ---- ----
1.5 V 1.8
10 uA
---- 40 ---- deg
IF=20mA
IF=20mA IF=100mA VR=5V
IF=20mA
Rank
Condition:IF=20mA
Unit mW/sr
Bin Number
M
N
P
Q
Min 7.8 11.0 15.0 21.0
Max 12.5 17.6 24.0 34.0
Revi3sion Copy:rig5ht © 2010, Everlight All Rights Reserved. Release Date :MAY.23.2013. Issue NRo:eDleIRa-0s0e00D72a1te:2013-05-2w7w1w4.:e3v9e:r4li5g.h0t.com
LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10
Typical Electro-Optical Characteristics Curves
Forward Current vs. Ambient Temperature
Spectral Distribution
Ie-Radiant Intensity(mW/sr)
Relative Radinat Intensity (%)
0 -40 -20 0 20 40 60 80 100
1.0
0.8
0.6
0.4
0.2
0.0
700
750
800
850
900
950
1000
1050
Wavelength (nm)
Radiant Intensity vs. Forward Current
Relative Radiant Intensity vs. Angular Displacement
100 80 60 40 20 0 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10
IF-Forward Current (A)
-20 -10 0
10 20 30
1.0 40
0.9 50 0.8 60 0.7 70
80
0.6 0.4 0.2 0 0.2 0.4 0.6
Revi4sion Copy:rig5ht © 2010, Everlight All Rights Reserved. Release Date :MAY.23.2013. Issue NRo:eDleIRa-0s0e00D72a1te:2013-05-2w7w1w4.:e3v9e:r4li5g.h0t.com
LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10 Package Dimension
Note: Tolerances unless dimensions ±0.25mm
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LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10
Label Form Specification
Pb EVERLIGHT
CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX
LOT NO : XXXXXXXXXX
RoHS
CAT : XXX HUE : XXX REF : XXX
Reference : XXXXXXXX
‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number ‧X: Month ‧Reference: Identify Label Number
Packing Specification ■ Anti-electrostatic bag
■ Inner Carton
■ Outside Carton
■ Packing Quantity 1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton
Revi6sion Copy:rig5ht © 2010, Everlight All Rights Reserved. Release Date :MAY.23.2013. Issue NRo:eDleIRa-0s0e00D72a1te:2013-05-2w7w1w4.:e3v9e:r4li5g.h0t.com
LifecyclePhase:
Expired Period: Forever
DATASHEET 5.0mm Infrared LED IR333C/H0/L10
Notes
1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are .