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SG-350 Dataheets PDF



Part Number SG-350
Manufacturers Epson Company
Logo Epson Company
Description SMALL HIGH-FREQUENCY CRYSTAL OSCILLATOR
Datasheet SG-350 DatasheetSG-350 Datasheet (PDF)

Crystal oscillator SG-350 / 550 seriesSMALL HIGH-FREQUENCY CRYSTAL OSCILLATOR Product number (please refer to page 2) Q33350xxxxxxx00 Q33550xxxxxxx00 • Operable 1.8 V. (SEF) • Low current consumption due to use of CMOS technology. (SEF 1.8 V Noload, 48 MHz 1.5 mA Typ.) • Low current consumption by standby function (ST). • Available for lead (Pb)-free soldering. • Complete lead (Pb)-free product. Actual size SG-350 SG-550  Specifications (characteristics) Item Output frequency range Power.

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Crystal oscillator SG-350 / 550 seriesSMALL HIGH-FREQUENCY CRYSTAL OSCILLATOR Product number (please refer to page 2) Q33350xxxxxxx00 Q33550xxxxxxx00 • Operable 1.8 V. (SEF) • Low current consumption due to use of CMOS technology. (SEF 1.8 V Noload, 48 MHz 1.5 mA Typ.) • Low current consumption by standby function (ST). • Available for lead (Pb)-free soldering. • Complete lead (Pb)-free product. Actual size SG-350 SG-550  Specifications (characteristics) Item Output frequency range Power source Max. supply voltage voltage Operating voltage Temperature range temperature temperature Frequency stability Current consumption Standby current Duty High output voltage Low output voltage Output load condition Output enable disable input voltage Output rise time Output fall time Oscillation start up time Aging Symbol f0 VDD-GND VDD TSTG TOPR Δf/f0 Iop IST tw/ t VOH VOL CL VIH VIL tR tF tOSC fa Specifications SEF SDF SCF 2.000 MHz to 48.0000 MHz -0.3 V to +4.2 V 1.8 V Typ. 1.6 V to 2.2 V 2.5 V Typ. 2.2 V to 3.0 V 3.3 V Typ. 2.7 V to 3.6 V -40 °C to +125 °C -40 °C to +85 °C B : ±50 x 10-6 Max. C : ±100 x 10-6 Max. M : ±100 x 10-6 Max. – L : ±50 x 10-6 Max. 1.5 mA Max. 1.5 mA Max. 1.5 mA Max. 1.5 mA Max. 1.5 mA Max. 2.0 mA Max. 1.5 mA Max. 2.0 mA Max. 2.5 mA Max. 2.0 mA Max. 2.0 mA Max. 2.5 mA Max. 2.0 mA Max. 2.5 mA Max. 3.5 mA Max. 3.0 mA Max. 3.5 mA Max. 4.5 mA Max. ––– 0.7 µA Max. (0.2 µA Typ.) 1.5 µA Max. (0.5 µA Typ.) 2.0 µA Max. (1.0 µA Typ.) 45 % to 55 % 45 % to 55 % 40 % to 60 % 40 % to 60 % ––– ––– 0.9 VDD Min. 0.1 VDD Max. 15 pF Max. 80 % VDD Min. 20% VDD Min. 4.0 ns Max. 4.0 ns Max. 10 ms Max. ±5 x 10-6 Max.  External dimensions SCG -0.5 V to +7.0 V 2.7 V to 3.6 V – – – S : ±25 x 10-6 – – – – – – – 12 mA Max. 50 µA Max. – – – – 40 % to 60 % 45 % to 55 % VDD -0.4 Min. 0.4 V Max. 70 % VDD Min. 3.0 ns Max. 3.0 ns Max. 12 ms Max. ±10 x 10-6 Max. Remarks VDD = GND 1.8 V Typ. 1.6 V to 2.2 V Stored as bare product -20 ˚C to +70 ˚C -20 ˚C to +70 ˚C -40 ˚C to +85 ˚C -20 ˚C to +70 ˚C -40 ˚C to +85 ˚C VDD ±5% No load, 2.0 MHz ≤ fo ≤ 4.0 MHz No load, 4.0 MHz < fo ≤ 8.0 MHz No load, 8.0 MHz < fo ≤ 16 MHz No load, 16 MHz < fo ≤ 25 MHz No load, 25 MHz < fo ≤ 33 MHz No load, 33 MHz < fo ≤ 48 MHz No load, M_a__x_. frequency range. ST = GND 2 MHz ≤ fo ≤ 16 MHz 16 MHz < fo ≤ 33 MHz 33 MHz < fo ≤ 40 MHz 50% VDD 40 MHz < fo ≤ 48 MHz CL ≤ 15 pF VDD = 2.7 V to 3.6 V VDD = 3.0 V to 3.6 V IOH = -3.0 mA (SEF / SDE / SCF) / -8.0 mA (SCG) IOL = 3.0 mA (SEF / SDE / SCF) / 8.0 mA (SCG) Max. frequency and Max. operating voltage range. ____ ST Pin 20 % → 80 % VDD, CL ≤ 15 pF 80 % → 20 % VDD, CL ≤ 15 pF Time at minimum operating voltage to be 0 s Ta = +25 °C, 10 year / SG-510, first year / SG-550 (Unit: mm)  0.35 #3 #4 1.6 2.6 ±0.1 3.3 ±0.1 0.1 #2 2.2 #1 0.45 1.15 ±0.05  Recommended soldering pattern  1.4 0.67 0.57  5.0±0.2 #4 #3 2.8 3.2±0.2 #1 #2 1.15±0.05 1.0 2.54 0min. (0.35)  1.6 NO. Pin terminal 1 OE or ST 2 GND 3 OUT 4 VDD Note. 0.1 ST pin - "H" or "open" : Specified frequency output. ST pin - "L" : Output is low level (weak pull-down), 2.5 (0.35) oscillation stops. (Unit: mm) 1.5 1.2 1.9 2.2 35 2.4 2.54 THE CRYSTALMASTER E N E R G Y S AV I N G E P S O N EPSON offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display (LCD) modules, and crystal devices. These savings are achieved through a sophisticated melding of three different efficiency technologies. Power saving technology provides low power consumption at low voltages. Space saving technology provides further reductions in product size and weight through super-precise processing and high-density assembly technology. Time saving technology shortens the time required for design and development on the customer side and shortens delivery times. Our concept of Energy Saving technology conserves resources by blending the essence of these three efficiency technologies. The essence of these technologies is represented in each of the products that we provide to our customers. In the industrial sector, leading priorities include measures to counter the greenhouse effect by reducing CO2, measures to preserve the global environment, and the development of energyefficient products. Environmental problems are of global concern, and although the contribution of energy-saving technology developed by EPSON may appear insignificant, we seek to contribute to the development of energy-saving products by our customers through the utilization of our electronic devices. EPSON is committed to the conservation of energy, both for the sake of people and of the planet on which we live. WORKING WITH ENVIRONMENTAL ISSUES In 1988, Seiko Epson led in working to abolish CFCs, and perfect abolition of those ozone layer-destroying substances was achieved in 1992. In 1998, the 10th year of start of the CFC-free activity, Seik.


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