Package outline
Philips Semiconductors
PDF: 2003 Mar 28
Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body ...
Description
Philips Semiconductors
PDF: 2003 Mar 28
Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
y X
c
36 37
25 24 Z E
A
48 1 e
pin 1 index
wM bp
D HD
e
wM bp 13
E HE
12 ZD v M A
B vM B
A
A2 A1
(A3)
Lp L
detail X
θ
0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions)
A UNIT max. A1 A2 A3 bp
c D(1) E(1) e
HD HE L
Lp
v
w
y ZD (1) ZE (1) θ
mm
1.6
0.20 0.05
1.45 1.35
0.25
0.27 0.17
0.18 0.12
7.1 6.9
7.1 6.9
0.5
9.15 9.15 8.85 8.85
1
0.75 0.45
0.2
0.12
0.1
0.95 0.95 0.55 0.55
7o 0o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT313-2
IEC 136E05
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN PROJECTION
ISSUE DATE
00-01-19 03-02-25
...
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