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SA614A Dataheets PDF



Part Number SA614A
Manufacturers NXP
Logo NXP
Description Low power FM IF system
Datasheet SA614A DatasheetSA614A Datasheet (PDF)

SA614A Low power FM IF system Rev. 4 — 14 February 2014 Product data sheet 1. General description The SA614A is an improved monolithic low-power FM IF system. It incorporates two limiting intermediate frequency amplifiers, quadrature detector, muting, logarithmic received signal strength indicator, and voltage regulator. The SA614A features higher IF bandwidth (25 MHz) and temperature compensated RSSI and limiters permitting higher performance application compared with the SA604. The SA614A is.

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SA614A Low power FM IF system Rev. 4 — 14 February 2014 Product data sheet 1. General description The SA614A is an improved monolithic low-power FM IF system. It incorporates two limiting intermediate frequency amplifiers, quadrature detector, muting, logarithmic received signal strength indicator, and voltage regulator. The SA614A features higher IF bandwidth (25 MHz) and temperature compensated RSSI and limiters permitting higher performance application compared with the SA604. The SA614A is available in a SO (surface-mounted miniature) package. 2. Features and benefits  Low power consumption: 3.3 mA typical  Temperature compensated logarithmic RSSI with a 90 dB dynamic range  Two audio outputs - muted and unmuted  Low external component count; suitable for crystal/ceramic filters  Excellent sensitivity: 1.5 V across inputs pins (0.22 V into 50  matching network) for 12 dB SINAD (SIgnal-to-Noise-And-Distortion ratio) for 1 kHz tone with RF at 45 MHz and IF at 455 kHz  SA614A meets cellular radio specifications 3. Applications  Cellular radio FM IF  High performance communication receiver  Intermediate frequency amplification and detection up to 25 MHz  RF level meter  Spectrum analyzer  Instrumentation  FSK and ASK data receivers 4. Ordering information Table 1. Ordering information Tamb = 40 C to +85 C Type number Package Name Description SA614AD SO16 plastic small outline package; 16 leads; body width 3.9 mm SA614AHR HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; body 3  3  0.5 mm Version SOT109-1 SOT1039-2 NXP Semiconductors 5. Block diagram SA614A Low power FM IF system GND 16 (13) 15 (12) 14 (11) 13 (10) 12 (9) 11 (8) 10 (7) 9 (6) IF AMP VOLTAGE REGULATOR LIMITER SIGNAL STRENGTH QUAD DET MUTE 1 (14) 2 (15) 3 (16) 4 (1) GND VCC 5 (2) 6 (3) 7 (4) 8 (5) aaa-009746 Pin numbers for SO16; HXQFN16 pins shown in parentheses. Fig 1. Block diagram of SA614A SA614A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 14 February 2014 © NXP B.V. 2014. All rights reserved. 2 of 28 NXP Semiconductors 6. Pinning information 6.1 Pinning SA614A Low power FM IF system IF_AMP_DECOUPL 1 GND 2 MUTE_INPUT 3 VCC 4 RSSI_OUTPUT 5 MUTE_AUD_OUTP 6 UNMUTE_AUD_OUTP 7 QUADRATURE_INPUT 8 Fig 2. Pin configuration for SO16 16 IF_AMP_INPUT 15 IF_AMP_DECOUPL 14 IF_AMP_OUTPUT SA614A 13 GND 12 LIMITER_INPUT 11 LIMITER_DECOUPL 10 LIMITER_DECOUPL 9 LIMITER_OUTPUT aaa-009743 16 MUTE_INPUT 15 GND 14 IF_AMP_DECOUPL 13 IF_AMP_INPUT terminal 1 index area VCC 1 RRSI_OUTP 2 MUTE_AUD_OUTP 3 UNMUTE_AUD_OUTP 4 SA614A (1) 12 IF_AMP_DECOUPL 11 IF_AMP_OUTPUT 10 GND 9 LIMITER_INPUT aaa-009745 QUADRATURE_INPUT 5 LIMITER_OUTPUT 6 LIMITER_DECOUPL 7 LIMITER_DECOUPL 8 Transparent top view (1) Die Attach Paddle (DAP). Fig 3. Pin configuration for HXQFN16 SA614A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 14 February 2014 © NXP B.V. 2014. All rights reserved. 3 of 28 NXP Semiconductors SA614A Low power FM IF system 6.2 Pin description Table 2. Pin description Symbol Pin SO16 IF_AMP_DECOUPL 1 GND 2 MUTE_INPUT 3 VCC RSSI_OUTPUT 4 5 MUTE_AUD_OUTP 6 UNMUTE_AUD_OUTP 7 QUADRATURE_INPUT 8 LIMITER_OUTPUT 9 LIMITER_DECOUPL 10 LIMITER_DECOUPL 11 LIMITER_INPUT 12 GND 13 IF_AMP_OUTPUT 14 IF_AMP_DECOUPL 15 IF_AMP_INPUT 16 -- Description HXQFN16 14 IF amplifier decoupling 15 ground 16 mute input 1 supply voltage 2 RSSI output 3 mute audio output 4 unmute audio output 5 quadrature input 6 limiter output 7 limiter decoupling 8 limiter decoupling 9 limiter input 10[1] ground 11 IF amplifier output 12 IF amplifier decoupling 13 IF amplifier input DAP exposed Die Attach Paddle [1] HXQFN16 package supply ground is connected to both GND pin and exposed center pad. GND pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad must be soldered to the board using a corresponding thermal pad on the board. For proper heat conduction through the board, thermal vias must be incorporated in the PCB in the thermal pad region. SA614A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 14 February 2014 © NXP B.V. 2014. All rights reserved. 4 of 28 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x NXP Semiconductors 7. Functional description SA614A Product data sheet All information provided in this document is subject t.


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