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Part Number S3MB
Manufacturers Taiwan Semiconductor
Logo Taiwan Semiconductor
Description 3.0 AMPS. Surface Mount Rectifiers
Datasheet S3MB DatasheetS3MB Datasheet (PDF)

S3AB – S3MB Taiwan Semiconductor 3A, 50V - 1000V Standard Surface Mount Rectifier FEATURES ● Glass passivated chip junction ● Ideal for automated placement ● Low forward voltage drop ● High surge current capability ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● Lighting application ● Converter KEY PARAMETERS PARAMETER VALUE UNIT IF VRRM IFSM TJ MAX Package 3 A .

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S3AB – S3MB Taiwan Semiconductor 3A, 50V - 1000V Standard Surface Mount Rectifier FEATURES ● Glass passivated chip junction ● Ideal for automated placement ● Low forward voltage drop ● High surge current capability ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● Lighting application ● Converter KEY PARAMETERS PARAMETER VALUE UNIT IF VRRM IFSM TJ MAX Package 3 A 50 - 1000 V 80 A 150 °C DO-214AA (SMB) Configuration Single die MECHANICAL DATA ● Case: DO-214AA (SMB) ● Molding compound meets UL 94V-0 flammability rating ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test ● Polarity: Indicated by cathode band ● Weight: 0.090g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER Marking code on the device S3 S3 S3 S3 S3 SYMBOL AB BB DB GB JB S3 S3 S3 S3 S3 AB BB DB GB JB Repetitive peak reverse voltage VRRM 50 100 200 400 600 Reverse voltage, total rms value VR(RMS) 35 70 140 280 420 Forward current IF 3 Surge peak forward current, 8.3ms single half sine-wave superimposed IFSM 80 on rated load Junction temperature TJ - 55 to +150 Storage temperature TSTG - 55 to +150 S3 S3 UNIT KB MB S3 S3 KB MB 800 1000 V 560 700 V A A °C °C 1 Version: M2102 S3AB – S3MB Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER Junction-to-lead thermal resistance SYMBOL RӨJL TYP 10 UNIT °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage(1) Reverse current @ rated VR(2) Junction capacitance Reverse recovery time Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms CONDITIONS IF = 3A, TJ = 25°C TJ = 25°C TJ = 125°C 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A Irr = 0.25A SYMBOL VF IR CJ trr TYP 40 1500 MAX 1.15 10 250 - - UNIT V µA µA pF ns ORDERING INFORMATION ORDERING CODE(1) PACKAGE S3xB DO-214AA (SMB) Notes: 1. "x" defines voltage from 50V(S3AB) to 1000V(S3MB) PACKING 3,000 / Tape & Reel 2 Version: M2102 AVERAGE FORWARD CURRENT (A) CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve 4 S3AB – S3MB Taiwan Semiconductor Fig.2 Typical Junction Capacitance 100 3 CAPACITANCE (pF) 2 10 1 f=1.0MHz Vsig=50mVp-p 0 1 25 50 75 100 125 150 1 10 100 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) INSTANTANEOUS FORWARD CURRENT (A) Fig.3 Typical Reverse Characteristics 100 10 TJ=125°C Fig.4 Typical Forward Characteristics 100 10 1 10 0.1 UF1DLW TJ=125°C TJ=25°C 1 TJ=25°C 0.1 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10.01 Pulse width 0.001 Pulse Width=300μs 0.3 0.4 0.5 0.6 0.7 01.8% Du0t.y9Cycl1e 0.1 1.1 1.2 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 FORWARD VOLTAGE (V) (A ) INSTANTANEOUS REVERSE CURRENT (μA) 3 Version: M2102 S3AB – S3MB Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.5 Maximum Non-Repetitive Forward Surge Current 100 8.3ms single half sine wave 80 PEAK FORWARD SURGE CURRENT (A) 60 40 20 0 1 10 100 NUMBER OF CYCLES AT 60 Hz Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: M2102 PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) S3AB – S3MB Taiwan Semiconductor SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code 5 Version: M2102 S3AB – S3MB Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: M2102 .


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