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MAX17506 Dataheets PDF



Part Number MAX17506
Manufacturers Maxim
Logo Maxim
Description Synchronous Step-Down DC-DC Converter
Datasheet MAX17506 DatasheetMAX17506 Datasheet (PDF)

MAX17506 4.5V–60V, 5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation General Description The MAX17506 high-efficiency, high-voltage, synchronous step-down DC-DC converter with integrated high-side MOSFET operates over a 4.5V to 60V input. The converter can deliver up to 5A and generates output voltages from 0.9V up to 0.9 x VIN. The feedback (FB) voltage is accurate to within ±1.4% over -40°C to 125°C. The MAX17506 uses peak current-mode control. The device .

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MAX17506 4.5V–60V, 5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation General Description The MAX17506 high-efficiency, high-voltage, synchronous step-down DC-DC converter with integrated high-side MOSFET operates over a 4.5V to 60V input. The converter can deliver up to 5A and generates output voltages from 0.9V up to 0.9 x VIN. The feedback (FB) voltage is accurate to within ±1.4% over -40°C to 125°C. The MAX17506 uses peak current-mode control. The device can be operated in the pulse-width modulation (PWM), pulse-frequency modulation (PFM), and discontinuous conduction mode (DCM) control schemes. The device is available in a 20-pin (5mm x 5mm) Thin QFN (TQFN) package. Simulation models are available. Applications ● Industrial Power Supplies ● Distributed Supply Regulation ● Base Station Power Supplies ● Wall Transformer Regulation ● High-Voltage Single-Board Systems ● General-Purpose Point-of-Load Ordering Information appears at end of data sheet. Benefits and Features ● Reduces External Components and Total Cost • No Schottky-Synchronous Operation • Internal Compensation for Any Output Voltage • Built-In Soft-Start • All-Ceramic Capacitors, Compact Layout ● Reduce Number of DC-DC Regulators to Stock • Wide 4.5V to 60V Input • Adjustable 0.9V to 0.9 x VIN Output • 100kHz to 2.2MHz Adjustable Switching Frequency with External Synchronization ● Reduces Power Dissipation • Peak Efficiency > 95% • PFM/DCM Modes Enables Enhanced Light-Load Efficiency • Auxiliary Bootstrap LDO for Improved Efficiency • 3.5FA Shutdown Current ● Operates Reliably in Adverse Industrial Environments • Hiccup or Latchoff Mode Overload Protection • DL to LX Short Detection Feature • Built-In Output Voltage Monitoring with RESET • Programmable EN/UVLO Threshold • Monotonic Startup into Prebiased Load • Overtemperature Protection • -40NC to +125NC Operation Typical Application Circuit for 5V Output VIN 7.5V-60V C6 2.2μF EN/UVLO VIN VIN VIN VIN RT BST MODE /SYNC VCC LX SGND CF RESET MAX17506 LX LX DL C11 0.1μF SS PGND EXTVCC FB C1 2.2μF C2 2.2μF L1 4.7μH C8 N1 22μF C9 22μF C7 0.022 μF C10 22μF FSW = 450kHz VOUT 5V, 5A R3 158 k R4 34.8k 19-7453; Rev 0; 11/14 MAX17506 4.5V–60V, 5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation Absolute Maximum Ratings VIN to PGND..........................................................-0.3V to +65V EN/UVLO, SS to SGND.........................................-0.3V to +65V LX to PGND................................................-0.3V to (VIN + 0.3V) BST to PGND.........................................................-0.3V to +70V BST to LX..............................................................-0.3V to +6.5V BST to VCC............................................................-0.3V to +65V FB, CF, RESET, MODE/SYNC, RT to SGND.......-0.3V to +6.5V DL, VCC to PGND.................................................-0.3V to +6.5V SGND to PGND.....................................................-0.3V to +0.3V EXTVCC to PGND.................................................-0.3V to +24V LX Total RMS Current.........................................................±9.9A Output Short-Circuit Duration.....................................Continuous Continuous Power Dissipation (TA = +70°C) (multilayer board) TQFN (derate 33.3mW/°C above TA = +70°C).......2666.7mW Operating Temperature Range.......................... -40NC to +125°C Junction Temperature.......................................................+150°C Storage Temperature Range............................. -65NC to +160°C Lead Temperature (soldering, 10s).................................. +300°C Soldering Temperature (reflow)........................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TQFN Junction-to-Ambient Thermal Resistance (θJA)...........30°C/W Junction-to-Case Thermal Resistance (θJC)..................2°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (VIN = VEN/UVLO = 24V, RRT = OPEN (450kHz), CVCC = 2.2µF, VPGND = VSGND = VMODE/SYNC = 0V, LX = SS = RESET = open, VBST to VLX = 5V, VFB = 1V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to SGND, unless otherwise noted.) (Note 2) PARAMETER INPUT SUPPLY (VIN) Input.


C2912 MAX17506 RT8100


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