Document
Micron Confidential and Proprietary
Advance‡
32Gb, 64Gb, 128Gb: NAND Flash Features
NAND Flash Memory
MT29F32G08MAA ES, MT29F32G08CBAAA, MT29F64G08CFAAA, MT29F64G08CEAAA, MT29F128G08TAA ES, MT29F128G08CJAAA, MT29F128G08CKAAA
Features
• Open NAND Flash Interface (ONFI) 2.0-compliant • Multilevel cell (MLC) technology • Organization
Page size: x8: 4314 bytes (4096 + 218 bytes) – Block size: 128 pages (512K + 27K bytes) – Plane size: 4096 blocks – Device size: 32Gb, 8192 blocks; 64Gb, 16,384
blocks; 128Gb, 32,768 blocks • READ performance
– Random read: 50µs – Sequential read: 20ns • PROGRAM performance – Page program: 900µs (TYP) – Block erase: 3ms (TYP) • Endurance: 10,000 PROGRAM/ERASE cycles1 • First block (block address 00h) guaranteed to be valid with ECC when shipped from factory1 • Industry-standard basic NAND Flash command set • Advanced command set – PROGRAM PAGE CACHE MODE – PAGE READ CACHE MODE – Two-plane commands – Interleaved die operations – READ UNIQUE ID • Operation status byte provides a software method of detecting: – Operation completion – Pass/fail condition – Write-protect status • Ready/busy# (R/B#) signal provides a hardware method of detecting PROGRAM and ERASE cycle completion • WP# signal: entire-device hardware write protect • RESET required as first command after power-up • INTERNAL DATA MOVE operations supported within the plane from which data is read
Figure 1: 48-Pin TSOP Type 1
Options
• Density2: 32Gb, 64Gb, 128Gb
• Device width: x8
• Configuration:
# of die # of CE# # of R/B# I/O
TSOP
11
1 Common
TSOP
22
2 Common
TSOP
42
2 Common
LGA
22
2 Separate
LGA
42
2 Separate
• Vcc: 2.7V–3.6 V
• Package: 48-pin TSOP type I (lead-free plating),
52-pad LGA
• Operating temperature:
– Commercial temperature (0°C to +70°C)
– Extended temperature (–40°C to +85°C)
Notes: 1. For details, see “Error Management” on page 89.
2. For part numbering and markings, see Figure 2 on page 2.
PDF: 09005aef8331b189 / Source: 09005aef8331b1c4 32gb_nand_mlc_l63a__1.fm - Rev. A 12/08 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2008 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Micron Confidential and Proprietary
Advance
32Gb, 64Gb, 128Gb: NAND Flash Part Numbering Information
Part Numbering Information
Micron NAND Flash devices are available in different configurations and densities (see Figure 2).
Figure 2: Part Number Chart for 32Gb, 64Gb TSOP Engineering Samples
Micron Technology
MT 29F 32G 08 M A A WC
Product Family 29F = Single-supply NAND Flash memory
Density 32G = 32Gb 64G = 64Gb
Device Width 08 = 8 bits
Classification
# of die # of CE# # of R/B# M1 1 1 T4 2 2
I/O Common Common
Operating Voltage Range A = 3.3V (2.7–3.6V)
Feature Set A = Feature set A
ES :A
Design Revision A = First revision
Production Status ES = Engineering sample
Operating Temperature Range Blank = Commercial (0°C to +70°C) ET = Extended (–40°C to +85°C)
Reserved for Future Use Blank
NAND Flash Performance Blank = Standard
Package Code WC = 48-pin TSOP I (lead-free)
PDF: 09005aef8331b189 / Source: 09005aef8331b1c4 32gb_nand_mlc_l63a__1.fm - Rev. A 12/08 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2008 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
Advance
32Gb, 64Gb, 128Gb: NAND Flash Part Numbering Information
Figure 3: Part Number Chart
MT 29F 32G 08 C B A A A WC
Micron Technology
Product Family 29F = Single-supply NAND Flash memory
Density 32G = 32Gb 64G = 64Gb 128G = 128Gb
Device Width 08 = 8 bits
Cell Type C = MLC-2
Classification
# of die # of CE#
B1
1
E2
2
F2
2
J4
2
K4
2
# of R/B# 1 2 2 2 2
I/O 1 2 1 1 2
Operating Voltage Range A = 3.3V (2.7–3.6V)
:A
Design Revision A = First revision
Production Status Blank = Production
Reserved for Future Use Blank
Operating Temperature Range Blank = Commercial (0°C to +70°C) ET = Extended (–40°C to +85°C) WT = Wireless (–25°C to +85°C)
Speed Grade Blank (if no grade defined)
Package Code WC = 48-pin OCPL TSOP I (lead-free) WP = 48-pin CPL TSOP I (lead-free) C5 = 52-pad VLGA
14mm x 18mm x 1mm (lead-free)
Interface A = Async only
Feature Set A = Feature set A
Valid Part Number Combinations
After building the part number from the part numbering chart, verify that the part number is offered and valid by using the Micron Parametric Part Search Web site at www.micron.com/products/parametric. If the device required is not on this list, contact the factory.
PDF: 09005aef8331b189 / Source: 09005aef8331b1c4 32gb_nand_mlc_l63a__1.fm - Rev. A 12/08 EN
3 Micron Technology, Inc., reserves the right to change products or specifications without .