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LDTA123EET1G Dataheets PDF



Part Number LDTA123EET1G
Manufacturers LRC
Logo LRC
Description Bias Resistor Transistors
Datasheet LDTA123EET1G DatasheetLDTA123EET1G Datasheet (PDF)

LESHAN RADIO COMPANY, LTD. Bias Resistor Transistors PNP Silicon Surface Mount Transistors With Monolithic Bias Resistor Network This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a .

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LESHAN RADIO COMPANY, LTD. Bias Resistor Transistors PNP Silicon Surface Mount Transistors With Monolithic Bias Resistor Network This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SC-89 package which is designed for low power surface mount applications. ƽSimplifies Circuit Design ƽReduces Board Space ƽReduces Component Count ƽThe SC-89 Package can be Soldered using Wave or Reflow. ƽAvailable in 8 mm, 7inch/3000 Unit Tape & Reel ƽThis is Pb-Free Device. DEVICE MARKING AND ORDERING INFORMATION Device Marking Package Shipping LDTA123EET1G 6H SC-89 (Pb-Free) 3000/Tape&Reel MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc Collector Current IC 100 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation TA = 25°C Derate above 25°C Thermal Resistance – Junction-to-Ambient PD RθJA 200 (Note 1) 300 (Note 2) 1.6 (Note 1) 2.4 (Note 2) 400 (Note 2) mW mW/°C °C/W Junction and Storage Temperature Range TJ, Tstg –55 to +150 °C 1. FR–4 @ Minimum Pad 2. FR–4 @ 1.0 x 1.0 inch Pad LDTA123EET1 3 1 2 SC-89 PIN 1 BASE (INPUT) R1 R2 PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) MARKING DIAGRAM 3 XX M 12 xx = Specific Device Code M = Date Code Version 1.0 LDTA123EET1-1/3 LESHAN RADIO COMPANY, LTD. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol OFF CHARACTERISTICS Collector-Base Cutoff Current (VCB = 50 V, IE = 0) Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) Emitter-Base Cutoff Current (VEB = 6.0 V, IC = 0) Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) Collector-Emitter Breakdown Voltage (Note 3) (IC = 2.0 mA, IB = 0) ICBO ICEO IEBO V(BR)CBO V(BR)CEO ON CHARACTERISTICS (Note 3) DC Current Gain (VCE = 10 V, IC = 5.0 mA) Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 5 mA) Output Voltage (on) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kΩ) Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kΩ) Input Resistor Resistor Ratio 3. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% hFE VCE(sat) VOL VOH R1 R1/R2 250 200 Min – – – 50 50 8.0 – – 4.9 1.5 0.8 PD, POWER DISSIPATION (MILLIWATTS) 150 100 50 0 −50 RqJA = 600°C/W 0 50 100 TA, AMBIENT TEMPERATURE (°C) Figure 1. Derating Curve Typ – – – – – 15 – – – 2.2 1 150 LDTA123EET1 Max Unit 100 nAdc 500 nAdc 2.3 mAdc – Vdc – Vdc – 0.25 0.2 – 2.9 1.2 Vdc Vdc Vdc kΩ Version 1.0 LDTA123EET1-2/3 LESHAN RADIO COMPANY, LTD. LDTA123EET1 A -X- 3 12 B -Y- S K G 2 PL D 3 PL 0.08 (0.003) M X Y MN J C SC-89 -T- SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C-01 OBSOLETE, NEW STANDARD 463C-02. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A 1.50 1.60 1.70 0.059 0.063 0.067 B 0.75 0.85 0.95 0.030 0.034 0.040 C 0.60 0.70 0.80 0.024 0.028 0.031 D 0.23 0.28 0.33 0.009 0.011 0.013 G 0.50 BSC 0.020 BSC H 0.53 REF 0.021 REF J 0.10 0.15 0.20 0.004 0.006 0.008 K 0.30 0.40 0.50 0.012 0.016 0.020 L 1.10 REF 0.043 REF M −−− −−− 10 _ −−− −−− 10 _ N −−− −−− 10 _ −−− −−− 10 _ S 1.50 1.60 1.70 0.059 0.063 0.067 HH L G RECOMMENDED PATTERN OF SOLDER PADS Version 1.0 LDTA123EET1-3/3 .


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