MPXC2012DT1

Freescale Semiconductor Technical Data MPXC2011DT1 Rev. 3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor’s unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration. NOTE: Freescale Semiconductor is also offering the Chip Pak package in application--specific configurations, which will have an “SPX” prefix, followed by a four--digit number, unique to the specific customer. Features: Low Cost Integrated Temperature Compensation and Calibration Ratiometric to Supply Voltage Polysulfone Case Material (Medical, Class V Approved) Provided in Easy--to--Use Tape and Reel Application Examples Respiratory Diagnostics Air Movement Control Controllers Pressure Switching NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer’s housing. Use caution when handling the devices during all processes. MPXC2011DT1 MPXC2012DT1 Freescale Semiconductor Preferred Device PRESSURE SENSORS 0 to 75 mmH...