TSM100-33

PPTC/TSM Series Features Surface Mount Devices Lead free deivce Size 5045mm/2018 mils Surface Mount packaging for automated assembly Agency recognition: Applications Almost anywhere there is a low voltage power supply, up to DC60V and a load to be protested, including: Computer mother board, Modem. Telecommunication equipments A B ZZZ Dimensions (mm) 1.5 ±0.1 1.5 ±0.1 4.6 ±0.1 DC 3.4 ±0.1 Model TSM030 TSM050 TSM100 TSM100/33 TSM150 TSM200 min 4.44 4.44 4.44 4.44 4.44 4.44 Product dimensions (mm) AB max min max min 4.72 4.22 4.93 0.60 4.72 4.22 4.93 0.60 4.72 4.22 4.93 0.45 4.72 4.22 4.93 0.45 4.72 4.22 4.93 0.45 4.72 4.22 4.93 0.45 C max 1.10 1.10 0.80 0.80 0.80 0.80 D min 0.30 0.30 0.30 0.30 0.30 0.30 Environmental Specifications Test Conditions Passive aging Humidity aging Thermal shock 85℃,1000hrs 85℃,85%℃R.H.,168hrs 85℃,to-40℃,13times Resistance to solvent MIL-STD-202,Method 215 Vibration MIL-STD-202,Method 201 Ambient operating confitions:-40℃ to 85℃ Maximum surface of the device in the tripped state is 125℃ Resistance change ±5% typical ±5% typical ±33% typical No change No change Terminal pad materials Terminal pad solderability Termination pad characteristics Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. REV.2014.05.01 01 | www.spsemi.cn PPTC/TSM Series Model TSM030 TSM050 TSM100 TSM100/33 TSM150 TSM200 Ihold Itrip Vmax Imax Pd Rmin/max R1max Ihold (A) 0.30 0.55 1....