MDF02

SURFACE MOUNT BRIDGE MDF005 THRU MDF10 VOLTAGE RANGE CURRENT 50 to 1000 Volts 1.0 Amperes FEATURES Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability High temperature soldering guaranteed: 260℃/10 seconds at terminals MINI DFS 0.5 5o 4.7±0.2 6.65±0.15 5o 3.9±0.1 5o 0.5 1.10±0.02 2.4±0.2 0.2-0.3 MAX 2.9 MECHANICAL DATA Case: Epoxy, Molded plastic body Epoxy: UL94V-0 rate fkame retardant Polarity: Molded on body Lead: Plated terminals solderable per MIL-STD-202E method 208C Weight: 0.4 ounce, 0.1 gram 0.65±0.15 2.54±0.02 Dimensions in millimeters MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25℃ ambient temperature unless otherwise specified Single Phase, half wave, 60Hz, resistive or inductive load For capacitive load derate current by 20% SYMBOLS MDF005 MDF01 Maximum Reverse Peak Repetitive Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Output Current, 0.06”(1.5mm) lead length at TC=40℃ (Note 2) Peak Forward Surge Current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) Rating for Fusing (t＜8.3ms) Maximum Instantaneous Forward Voltage drop Per Bridge element 0.8A Maximum DC Reverse Current at rated DC blocking voltage per element TA=25℃ TA=125℃ VRRM VRMS VDC I(AV) IFSM I2t VF IR 50 100 35 70 50 100 Typical Junction Capacitance (NOTE 1) CJ Typical Thermal Resistance (NOTE 2) RΘJC O...