Document
SEMICONDUCTOR
TECHNICAL DATA
KPF500G01 ~ KPF102G01
Semiconductor Pressure Sensor
FEATURES Broad Pressure Range : 50~1,000kPa. High Sensitivity, Excellent Linearity. Highly Stable in Temperature Change.
APPLICATIONS Medical Deivces. Industrial Instrumentations. Pressure Switch, Water Height Control, Pneumatic Devices etc. Home Appliances.
MODEL NUMBER FOR ORDERING
KP F 000 G 00 A
Silicon Pressure Sensor
Package Pin Configuration No Mark : Standard
A : Type 1
ON/OFF Chip N:ON Chip (Amplified) F:OFF Chip (Not Amplified)
Rated Pressure 123 12 103=12,000kPa
Measuring Pressure A : Absolute Pressure D : Differential Pressure G : Gage Pressure
Package Type 00 : Die
01~ : Package Series
PIP1
MAXIMUM RATING
ITEM
SPEC.
UNIT
Model No. Classification
Rated Pressure
Measurable Pressure Range Maximum Pressure Load
Bridge Impedance Operating Temperature
KPF500G01 KPF101G01 KPF201G01 KPF401G01 KPF601G01 500 101 201 401 601 50 100 200 400 600 0.51 1.02 2.04 4.08 6.12
-50 ~ 50 -100 ~ 100 -100 ~ 200 -100 ~ 400 -100 ~ 600 Twice of Rated Pressure 3000 ~ 6000 -20 ~ 100
KPF801G01 KPF102G01
-
801 102 -
800
1000
kPa
8.16
10.20
kgf/
-100 ~ 800 -100 ~ 1000
kPa
1.5 Times of Reated Pressure kPa(kgf/ )
Storage Temperature
-40 ~ 120
ELECTRICAL CHARACTERISTICS
ITEM
SPEC.
Classification
500 101 201 401 601 801
Test Condition Compensational Temperature Range
Operating Input Current 1.5 constant, Ambient Temperature Ta=25 0 ~ 50
Full Scale Voltage
60 ~ 140
Offset Voltage
20
Linearity Pressure Hysteresis Mechanical Response Time
0.3 0.5 2
Temperature Coefficient Of Offset (TCO)
5.0
Temperature Coefficient Of Sensitivity (TCS)
2.5
Comment) 1. Operating humidity 25~80%RH. (unless otherwise noted) 2. Please, consult us when you use any other pressure media except air.
102
UNIT -
mV mV %FS %FS msec %FS %FS
2007. 6. 15
Revision No : 9
1/4
KPF500G01 ~ KPF102G01
RELIABILITY TEST
Life Test Environment Test Mechanical Test
ITEMS High Temp. Storage Low Temp. Storage
Steady State Operating Low Temp. Operating High Temp. Operating Temperature / Humidity Operating
Heat Resistance Temp. Cycle
Vibration
Drop
Lead Fatigue
Solderability
TEST CONDITIONS
120 , 1000hrs -40 , 1000hrs 25 5 , 1 million times, Rated Pressure -20 , 1 million times, Rated Pressure 100 , 1 million times, Rated Pressure 40 , 90%RH, 1 million times, Rated Voltage 260 , 10 seconds -40 ~120 , 30minutes/1Cycle, 100Cycles Amplitude : 1.5mm, Frequency : 10~55Hz, X, Y, Z(3-directions), 2 hrs each direction 75cm height, 2 times Tensile Strength : 9.8N(1kgf), 10seconds Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time 230 , 5 seconds
CHARACTERISTIC GRAPHS
1. Full Scale Voltage Characteristics
2. Temperature Coefficient of Offset (TCO)
Operating Input Current : 1.5mA, Temperature : 25 C
Operating Input Current : 1.5mA, Spec. : +_ 5.0 %FS
120 100
80 60 40 20
0 -20
0
1/2Pr Rated Pressure (kPa)
Pr
TCO (%FS)
5.0 4.0 3.0 2.0 1.0
0 -1.0 -2.0 -3.0 -4.0 -5.0
0
25 Temperature ( C)
50
TCS (%FS)
3. Temperature Coefficient of Sensitivity (TCS) Operating Input Current : 1.5mA, Spec. : +_ 2.5%FS
2.5 2.0 1.5 1.0 0.5
0 -0.5 -1.0 -1.5 -2.0 -2.5
0
25 Temperature ( C)
50
4. High Temperature continuous Operating Test 100°C, 1 million times : After testing, offset and full scale voltage variation is very small.
Offset Voltage Variation
3
2
1
0
-1
-2
-3
0
500,000
1,000,000
Pressure Cycle
Full Scale Voltage Variation (%FS)
Full Scale Voltage Variation
3
2
1
0
-1
-2
-3
0
500,000
1,000,000
Pressure Cycle
Full Scale Voltage (mV)
Offset Voltage Variation (%FS)
2007. 6. 15
Revision No :9
2/4
KPF500G01 ~ KPF102G01
PACKAGE DIMENSIONS AND PC BOARD PATTERN (Unit :mm)
Pressure Inlet Φ1.1
7.2
7.2
R 0.2 R 0.5
0.41
0.25+_ 0.1 9.5 +_1.5
Logo
6
Model No
5
Lot No
4
1
2
Remark
3
PIN CONFIGURATION
Terminal No. Meaning 1 (+)Input 2 (+)Output 3 (-)Input 4 (-)Input 5 (-)Output 6 Open
Φ4
Φ2.5
0 -0.1
4 5
2.5 +_ 0.25
0.8 3.5
1.75
4.3
0.5 +_ 0.1 2.5 +_ 0.25
7.5 0.9 dia
2.5 2.5
Pin Hole
Constant current source
i = 1.5mA
R4 5
1
R1 2
+
R3 R2
4 3
V -
2007. 6. 15
Revision No :9
3/4
KPF500G01 ~ KPF102G01
Note 1. Mounting on printed circuit boards
When mounting a transistor on a printed circuit, it is assumed that lead wires will be processed or reformed due to space limitation or relations with other components. Even if no such special processing reforming is conducted exercise care on the following points :
(a) Make the spaces of lead wire inserting holes on the printed circuit board the same as those of lead wires on a transistor.
(b) Even if The spaces are not the same, do not pull the lead wires or push heavily against the sensor element.
(c) Use a spacer for form a lead maintain space between a sensor and a printed circuit board, rather than closely contacting them with each other.
(d) When forming a lead prior to mounting onto a board - Bend the lead at a point 3mm or more apart from the body(Lead root). - Ben.